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Formed body, production method thereof, electronic device member and electronic device

A manufacturing method and molding technology, which are applied in the fields of semiconductor/solid-state device manufacturing, electrical components, chemical instruments and methods, etc., can solve the problem of thickening of the film of gas-barrier sheets, inability to exhibit gas-barrier properties, and a large number of processes. and other problems, to achieve the effect of excellent interlayer adhesion and gas barrier properties

Active Publication Date: 2013-07-17
LINTEC CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] However, the gas barrier sheets described in these documents have the following problems: the interlayer adhesion between the smooth layer and the inorganic material layer used as the gas barrier layer and electrode material is poor, and it is necessary to provide a layer between each layer to improve the interlayer. Adhesive functional film, the thickness of the obtained gas barrier sheet becomes thicker, and the number of steps increases accordingly
However, this method has a problem that sufficient gas barrier performance cannot be exhibited without controlling the thickness of the gas barrier layer to the order of microns

Method used

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  • Formed body, production method thereof, electronic device member and electronic device
  • Formed body, production method thereof, electronic device member and electronic device
  • Formed body, production method thereof, electronic device member and electronic device

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0341] A composition containing an acryloyl group-containing silicon-containing compound as a main component (trade name: AC-SQ TA-100, manufactured by Toagosei Co., Ltd.) was dissolved in ethyl acetate, and then 2 , 4,6-trimethylbenzoyl-diphenylphosphine oxide (trade name: DarocurTPO, manufactured by Ciba Specialty Chemicals Co., Ltd.), so that 2,4,6-trimethylbenzoyl-diphenyl The base phosphine oxide was 3 mass % by solid content ratio, and the solution A for primer layer formation was prepared.

[0342] The aforementioned primer was applied to a polyethylene terephthalate film (trade name: PET25T-61M, thickness 25 μm, manufactured by Toray Industries Inc., hereinafter referred to as "PET film") as a substrate layer. Solution A for layer formation was heated at 120° C. for 1 minute, and then irradiated with UV light using UV light rays (high-pressure mercury lamp, line speed, 20 m / min, cumulative light intensity 100 mJ / cm 2 , peak intensity 1.466W, number of passes 2 times),...

Embodiment 2

[0355] 1.90 g of tetraethoxysilane (trade name: Z-6697, manufactured by Dow Corning Toray Co., Ltd.) (12.5 mmol) and 8.79 g of 3-methacryloxypropyltriethoxysilane (commercial Name: KBM-503, manufactured by Shin-Etsu Chemical Co., Ltd.) (37.5 mmol) was dissolved in 50 ml of ethyl acetate, and 25 ml of distilled water was added and mixed. Several drops of phosphoric acid as a catalyst were added to the resulting mixture, followed by stirring at room temperature for 18 hours. After neutralizing by adding saturated aqueous sodium bicarbonate solution to the reaction liquid, liquid separation was performed to separate the organic layer. The organic layer was dried with anhydrous magnesium sulfate, ethyl acetate was distilled off under reduced pressure, and the residue was added to a large amount of n-hexane to obtain a precipitate. Next, the obtained precipitate was dissolved in ethyl acetate, and 2,4,6-trimethylbenzoyl-diphenylphosphine oxide (trade name: DarocurTPO, Ciba Special...

Embodiment 3

[0358] In Example 2, the usage amount of tetraethoxysilane was changed from 1.90g (12.5mmol) to 3.81g (25.0mmol), and the usage amount of 3-methacryloxypropyltriethoxysilane was changed from Except having changed 8.79g (37.5mmol) into 5.86g (25.0mmol), it carried out similarly to Example 2, and prepared the solution C for primer layer formation.

[0359] In Example 1, except having used the solution C for primer layer formation instead of the solution A for primer layer formation, it carried out similarly to Example 1, and the molded object 3 was produced.

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Abstract

The present invention is a formed body, a production method thereof, an electronic device member comprising the formed body, and an electronic device comprising the electronic device member, the formed body being formed by sequentially layering a base layer, a primer layer and a gas barrier layer, characterized in that: the primer layer is configured from a material containing at least carbon atoms, oxygen atoms and silicon atoms, and in which the binding energy peak position of the 2p electron orbital in the silicon atom is 101.5 to 104 eV in the X-ray photoelectron spectroscopy (XPS) measurement; and the gas barrier layer is configured from a material containing (I) a layer obtained by implanting an ion in a polymer layer containing at least one type selected from a group comprising a polysilazane-based compound, a polyorganosiloxane-based compound, a polycarbosilane-based compound and a polysilane-based compound, or (II) at least oxygen atoms and silicon atoms, the proportion of oxygen atoms present being 60 to 75%, the proportion of nitrogen atoms present being 0 to 10%, and the proportion of silicon atoms present being 25 to 35%, with respect to the entire amount of oxygen atoms, nitrogen atoms and silicon atoms in the surface portion, and the film density in the surface layer portion being 2.4 to 4.0 g / cm3.

Description

technical field [0001] The present invention relates to a molded body, a method for producing the molded body, a member for an electronic device including the molded body, and an electronic device including the member for an electronic device. Background technique [0002] In recent years, for image display devices, attempts have been made to manufacture flexible displays using synthetic resin sheets instead of glass substrates. However, compared with glass, synthetic resin sheets have problems such as easy permeation of gases such as water vapor and low surface smoothness, and there are many problems in practical use. [0003] In order to solve such problems, Patent Documents 1 and 2 propose a gas barrier sheet in which a smooth layer is provided on a synthetic resin sheet, and a gas barrier inorganic compound film is further laminated. [0004] However, the gas barrier sheets described in these documents have the following problems: the interlayer adhesion between the smo...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B32B27/00G02F1/1333H01L21/265C23C14/48C08J7/043C08J7/044C08J7/048
CPCC09D183/06C23C14/06C08J7/04C23C14/48H01L21/2236C09D183/08C08J7/042C08J7/123C08J2367/02C08J2483/04Y10T428/31663C08J7/048C08J7/043C08J7/044B32B27/06G02F1/1333H01L21/265
Inventor 铃木悠太近藤健
Owner LINTEC CORP
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