Production method of multilayer printed circuit board

Abstract

The invention discloses a production method of a multilayer printed circuit board. Two copper foil wire layers are disposed on upper and lower surfaces of a copper-clad substrate or insulating plate respectively, and circuit through holes by which the upper and lower surface are communicated are established between the layers. After wiring on the copper-clad substrate or insulating plate is complete, oxidation is performed and the copper-clad substrate or insulating plate is placed in an epoxy resin glue cell for cycle control of temperature, humidity and solid-content ratio. The copper-clad substrate or insulating plate is coated with an epoxy resin glue layer. After the epoxy resin glue layer fully solidifies, an epoxy resin thin glue layer is applied to the copper-clad substrate or insulating plate and is baked to semi-solid state. Multiple copper-clad substrates or insulating plates are stacked. After copper foils are spread to the top and bottom of the stack, the stack is subjected to high-temperature press-fitting. The press-fitted copper-clad substrates or insulating plates are subjected to surface circuit treatment, and circuit through holes are established between the plates to allow for communication of circuits in all layers. Flatness of the inner layer of the printed circuit board is improved, inner buried holes are smoothed, manufacturing yield of fine lines and uniformity of line width are improved, and bending and warping degree of the printed circuit board is lowered.

Description

Technical field [0001] The invention relates to a production process of a PCB build-up method, in particular to a manufacturing method of a multilayer printed circuit board. Background technique [0002] Due to the rapid progress of volume circuits, such as the speed of volume circuits, the reduction of area, and the increase in heat dissipation requirements, they immediately impact the packaging technology of volume circuits. Nowadays, the new packaging technology and the market demand for lightness, thinness, and small size have also impacted The technology of multi-layer boards, which is currently commonly known as High Density Interconnection (HDI) Printed Circuit Board (PCB), is aimed at high-density, fine-line, and blind-buried vias. The difficulty of controlling the thickness of the board and the difficulty of filling the blind and buried holes is an important topic at present. In order to solve this difficulty, a high-reliability Epoxy Resin Thin Core technology prod...

AI Technical Summary

Problems solved by technology

[0003] The purpose of the present invention is to make up for the defects of the prior art, and to provide a multilayer printed circuit board that can effectively solve the problems of poor flatness, explosive boards, and large differences in thickness of finished products in the production process of multilayer printed circuit boards. How to make a circuit board

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