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Plastic substrate surface processing method for obtaining self cleaning function

A technology of plastic base material and treatment method, which is applied in the fields of sanitary ware, automobiles and home appliances, can solve problems such as thermal stress defects and poor compactness, and achieve the effect of reducing bacterial infection

Active Publication Date: 2013-04-17
XIAMEN RUNNER IND CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Compared with other oxide processes, LPD has its own advantages: low temperature, low cost, diversity of substrates, etc.; the overall quality of the oxide film generated by thermal oxidation is better, but the thermal stress caused by higher oxidation temperature will also cause defects The existence of the state; the existence of the current path in the electrochemical deposition process leads to poor compactness and looseness of the film, etc.

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0021] Example 1 Surface treatment of modified PP plastic substrate

[0022] 1) Manually wipe the surface of PP plastic substrate with alcohol to remove oil;

[0023] 2) Spray a paint layer on the plastic substrate treated in step 1). The spray paint layer can be at least one of ultraviolet curing (UV) paint and polyurethane paint (PU) paint; the spraying method is a technology in the art In a method known to the person, the thickness of the paint layer can be 10-30 μm.

[0024] 3) After the plastic substrate treated in step 2) is modified by physical vapor deposition plasma, then the metal chromium layer is physically vapor deposited; the process conditions of the physical vapor deposition plasma modification can be an ion source current of 0.3 ~ 0.6A, bias voltage 20~80V, duty ratio 40%~80%, argon flow rate 10~100SCCM, oxygen flow rate 0~150SCCM, time 5~10min, in order to achieve the purpose of cleaning and activating the substrate surface; The process conditions for vapor deposi...

Embodiment 2

[0027] Example 2 Modified PP plastic substrate coating and drawing treatment

[0028] 1) Perform artificial alcohol wiping and degreasing treatment on the surface of the PP plastic substrate to remove the grease on the PP surface;

[0029] 2) Spray the paint layer, spray polyurethane (PU) paint on the paint line, spray a layer of polyurethane (PU) paint (paint thickness 30μm), send it to the infrared drying section for leveling and drying (70 ℃×120min).

[0030] 3) After the physical vapor deposition plasma modification, physical vapor deposition of the metal chromium layer is performed. The process conditions of physical vapor deposition plasma modification can be ion source current 0.3A, bias voltage 20V, duty cycle 40%, argon flow rate 100SCCM, oxygen flow rate 150SCCM, time 10min, in order to achieve the purpose of cleaning and activating the substrate surface The process conditions of physical vapor deposition of metal chromium layer can be multi-arc physical vapor deposition,...

Embodiment 3

[0033] Example 3 ABS plastic substrate coating and wire drawing treatment

[0034] 1) Perform artificial alcohol wiping and degreasing treatment on the surface of the ABS plastic substrate to remove the grease on the ABS surface;

[0035] 2) Spray the paint layer, spray ultraviolet curing (UV) paint on the paint line, spray a layer of UV paint (paint thickness 10μm), send it to the infrared drying section for leveling and drying (60℃) ×8min), after leveling and drying, it is sent to the UV curing section for UV irradiation curing and crosslinking (time 10s), the energy of UV irradiation curing is 1200mJ / cm 2 .

[0036] 3) After the physical vapor deposition plasma modification, physical vapor deposition of the metal chromium layer is performed. The process conditions of physical vapor deposition plasma modification can be ion source current 0.6A, bias voltage 80V, duty ratio 80%, argon flow rate 10SCCM, oxygen flow rate 100SCCM, time 5min, in order to achieve the purpose of cleaning...

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Abstract

The invention discloses a plastic substrate surface processing method for obtaining the self cleaning function, relates to a plastic surface processing method, and provides a surface processing method, which enables the plastic substrate surface to obtain water electrodeposited chromium metal appearance and texture as well as photochemical catalysis bacteria restraining and self cleaning functions, has an environmental-friendly whole process procedure and is free of hexavalent chromium pollution and damage. The method comprises the following steps: 1) removing oil on the plastic substrate surface; 2) spraying a paint layer on the plastic substrate treated in the step 1); 3) performing plasma modification to the plastic substrate, treated in the step 2), by means of physical vapor deposition, and then applying a metal layer on the plastic substrate by means of physical vapor deposition chromium; 4) performing normal-pressure plasma glowing treatment so as to enable the metal chromium layer surface of the plastic substrate to obtain hydrophilicity; and 5) performing liquid deposition to the plastic substrate treated in the step 4) to obtain a nano anatase type titanium dioxide transparent film.

Description

Technical field [0001] The invention relates to a plastic surface treatment method, in particular to a surface treatment method with a photocatalytic self-cleaning function on the surface of a plastic substrate, which can be applied to the fields of sanitary ware, automobiles, household appliances and the like. Background technique [0002] Liquid-Phase Deposition (LPD) is subordinate to the liquid phase epitaxy technology of semiconductor growth process. Growing SiO using LDP process 2 It is a newly developed technology. The solution is a supersaturated fluorosilicic acid solution, which uses the following reaction with water: H 2 SiF 6 +H 2 O→SiO 2 +6HF According to the above reaction, when H 2 SiF 6 The concentration, H 2 SiO occurs when the content of O increases or the concentration of HF decreases 2 Of deposition. At present, it has been adopted to add H to the solution 3 BO 3 , Al or water to speed up SiO 2 Of deposition. The deposition rate is 0.001~0.007nm / s, depending...

Claims

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Application Information

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IPC IPC(8): C23C14/20C23C14/02C23C18/00B05D7/24
Inventor 张先超余水李明仁
Owner XIAMEN RUNNER IND CORP
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