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Thermal field structure for casting polycrystalline silicon ingot

A polycrystalline silicon ingot and thermal field technology, which is applied in the directions of polycrystalline material growth, crystal growth, single crystal growth, etc., can solve the problems of low conversion efficiency and battery conversion efficiency, so as to improve conversion efficiency, reduce crystal defects, and suppress crystal The effect of defect generation

Inactive Publication Date: 2013-04-03
ALTUSVIA ENERGY TAICANG
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the polycrystalline silicon wafer produced by this method contains a large number of grain boundaries and micro-defects, and the conversion efficiency of the cell is low. Currently, the conversion efficiency of commercial polycrystalline silicon solar cells is about 17.0%.
[0004] Relatively low conversion efficiency has become the main bottleneck restricting the popularization of polysilicon solar cells. Although solar cell manufacturing technology has developed by leaps and bounds in recent years, and the cost of photovoltaic power generation has also been greatly reduced, it still cannot fully compete with thermal power and improve polysilicon solar cells. Battery efficiency is of great significance for achieving photovoltaic grid parity

Method used

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  • Thermal field structure for casting polycrystalline silicon ingot
  • Thermal field structure for casting polycrystalline silicon ingot
  • Thermal field structure for casting polycrystalline silicon ingot

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Embodiment

[0019] Such as Figure 2-3 As shown, a thermal field structure for casting polycrystalline silicon ingots includes a quartz crucible 1, a heat insulation plate 2, a side heater 9, a heat insulation layer 6, and a heat exchange platform 5, and the quartz crucible 1 is arranged on the heat exchange platform 5 Above, the outer wall of the crucible is provided with a crucible guard plate 12, the quartz crucible 1 is surrounded by a heat shield 2, the heat shield 1 is provided with a side heat insulation layer 6, and a side heater is provided between the two. 9. The distance between the outer wall of the heat shield 2 and the side heater 9 is greater than 1 cm, and the distance between the inner wall and the outer wall of the quartz crucible 1 is less than 5 cm, and the heat shield 2 is fixed on the side heat insulation layer 6 bottom, the upper part of the quartz crucible 1 is provided with an upper heat insulating layer 7, the lower part is provided with a lower heat insulating l...

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Abstract

The invention discloses a thermal field structure for casting a polycrystalline silicon ingot. The thermal field structure comprises a quartz crucible, thermal baffles, heaters, thermal insulating layers and a heat exchange table, wherein the quartz crucible is arranged on the heat exchange table, the thermal baffles are arranged at the periphery of the quartz crucible and are fixed at the bottoms of the side thermal insulating layers, the upper thermal insulating layer and the lower thermal insulating layer are respectively arranged above and below the quartz crucible, the side heaters are arranged between the thermal baffles and the side thermal insulating layers, and the upper heater is arranged between the upper thermal insulating layer and the quartz crucible. The thermal baffles added at the periphery of the quartz crucible enable a long crystal solid liquid interface to be always under the protection of the thermal baffles, reduce the thermal impact of the heaters on a crystal growth interface, and enable crystals to stably grow and inhibit the occurrence of crystal defects; and in the growth process of the crystals, the radiation of the heaters on a solidified silicon ingot is reduced, the latent heat of crystallization is facilitated to be transferred to the heat exchange tale through a solidification part, and the vertical growth of grains is facilitated, thus the conversion efficiency of a polycrystalline silicon solar cell can be effectively improved.

Description

technical field [0001] The invention relates to the field of polycrystalline silicon ingots for solar cells. Background technique [0002] Conventional energy will be exhausted one day, and new energy is destined to wait on the stage of history. Solar energy is an inexhaustible and inexhaustible energy source, and it is also considered to be the most potential alternative to traditional petrochemical energy products. Crystalline silicon cells account for 95% of the solar market, of which polycrystalline silicon cells account for about 70% of crystalline silicon cells. [0003] Polysilicon is mainly produced by directional solidification, that is, the silicon material is melted inside a closed thermal field, and then dissipated heat through the bottom, so that the silicon liquid is gradually solidified upwards to obtain a polysilicon ingot. Cut the silicon ingot into silicon wafers with a thickness of 180um--200um and a size of 156×156mm, which can be used for solar cell man...

Claims

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Application Information

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IPC IPC(8): C30B11/00C30B28/06C30B29/06
Inventor 孙海知邢国强郭宽新潘欢欢宋江
Owner ALTUSVIA ENERGY TAICANG
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