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Encapsulating structure of electronic element

An electronic component and potting technology, which is applied in the field of potting structure of high-power electronic components, can solve the problems of poor thermal conductivity of polymer heat sink parts, difficult processing of metal heat sink parts, high processing temperature of ceramic heat sink parts, etc. , to achieve the effect of improving heat dissipation, good elastic deformation capacity, and excellent thermal conductivity

Inactive Publication Date: 2013-01-23
CHENGDU GUOGUANG ELECTRIC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0011] If the surface of the heat generating part is uneven, the processing of the metal heat sink is difficult, and it is difficult to completely match the heat generating part; the processing temperature of the ceramic heat sink is extremely high (melting point of aluminum nitride ≥ 1800 ℃), and it is fragile and impact resistant Poor ability; poor thermal conductivity of polymer material heat sink

Method used

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  • Encapsulating structure of electronic element
  • Encapsulating structure of electronic element
  • Encapsulating structure of electronic element

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0092] Such as figure 2 As shown, the potting structure of the traveling wave tube according to the first embodiment of the present invention includes a slow-wave component 24 and a casing 21, and a composite heat-conducting material 23 is potted between the slow-wave component 24 and the casing 21, and the composite heat-conducting material 23 Aluminum particles coated with epoxy resin; the composite thermal conductive material 23 is composed of the following components:

[0093] A, 100 parts by weight of surface galvanized and copper-plated aluminum particles, the particle diameter of the aluminum particles is 0.1mm;

[0094] B, 10 weight parts through the epoxy resin prepolymer of amide curing agent and dodecyl glycidyl ether solidification; The mass ratio of described epoxy resin and curing agent and dodecyl glycidyl ether is 1:0.1 :0.1;

[0095] C, 1 weight part polyether ketone accelerator;

[0096] D. 1 part by weight of polyethersulfone toughening agent.

Embodiment 2

[0098] Such as figure 2 As shown, the potting structure of the traveling wave tube according to the first embodiment of the present invention includes a slow-wave component 24 and a casing 21, and a composite heat-conducting material 23 is potted between the slow-wave component 24 and the casing 21, and the composite heat-conducting material 23 Aluminum particles coated with epoxy resin; the composite thermal conductive material 23 is composed of the following components:

[0099] A, 100 parts by weight of surface galvanized and copper-plated aluminum particles, the particle diameter of the aluminum particles is 10mm;

[0100] B, 10 weight parts through the epoxy resin prepolymer of amide curing agent and dodecyl glycidyl ether solidification; The mass ratio of described epoxy resin and curing agent and dodecyl glycidyl ether is 1:0.1 :0.1;

[0101] C, 1 weight part polyether ketone accelerator;

[0102] D. 1 part by weight of polyethersulfone toughening agent.

Embodiment 3

[0104] Such as figure 2 As shown, the potting structure of the traveling wave tube according to the first embodiment of the present invention includes a slow-wave component 24 and a casing 21, and a composite heat-conducting material 23 is potted between the slow-wave component 24 and the casing 21, and the composite heat-conducting material 23 Aluminum particles coated with epoxy resin; the composite thermal conductive material 23 is composed of the following components:

[0105] A, 100 parts by weight of surface galvanized and copper-plated aluminum particles, the particle diameter of the aluminum particles is 1mm;

[0106] B, 0.1 weight part through the epoxy resin prepolymer solidified by aromatic amine curing agent and n-butyl glycidyl ether; The mass ratio of described epoxy resin and curing agent and n-butyl glycidyl ether is 1:0.1:0.1;

[0107] C, 1 weight part polyether ketone accelerator;

[0108] D. 1 part by weight of polyethersulfone toughening agent.

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Abstract

The invention discloses the encapsulating field of electronic elements, and specifically relates to an encapsulating structure of a high-power electronic element. The electronic element comprises a heat producing component and a shell. A composite thermal conductive material is encapsulated between the heat producing component and the shell, and the composite thermal conductive material is aluminum particles coated with resin. Compared with the existing heat-dissipating mode, the encapsulating structure of the electronic element disclosed by the invention has the characteristics of high heat conductivity, low encapsulating temperature, easy molding and the like.

Description

technical field [0001] The invention relates to the field of potting and sealing of electronic components, in particular to a potting structure of high-power electronic components. Background technique [0002] Electronic components can be divided into two categories: electronic components and electronic devices. Electronic components generally refer to finished products that do not change their molecular composition during production and processing, including resistors, capacitors and inductors; Products that have changed their molecular structure over time, including transistors, electron tubes, and integrated circuits. The traveling wave tube is a kind of electron tube, which is a microwave electron tube that realizes the amplification function by continuously modulating the speed of the electron beam. [0003] In order to keep electronic components in good working condition, heat sinks are generally installed at the heat generating parts, and the heat generated by the h...

Claims

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Application Information

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IPC IPC(8): H01J23/14
Inventor 邱葆荣陈涛陈燕郭锐宋琼英李国李新义陶浩明涛林玲
Owner CHENGDU GUOGUANG ELECTRIC
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