Method for preparing target for copper conductor of thin film transistor (TFT)-liquid crystal display (LCD) array substrate, and target

Abstract

The invention relates to a method for preparing a target for a copper conductor of a thin film transistor (TFT)-liquid crystal display (LCD) array substrate, and the target. The method for preparing the target for the copper conductor for the TFT-LCD array substrate comprises the following steps of: providing copper powder, and a discharge plasma activated sintering device; and 2, adding the copper powder into the discharge plasma activated sintering device and sintering to prepare the target for the copper conductor of the TFT-LCD array substrate. According to the method for preparing the target for the copper conductor of the TFT-LCD array substrate, the copper powder is sintered into the target by the discharge plasma activated sintering device; the method is simple in process and high efficiency; and the crystal orientation of the target can be effectively controlled, and the performance of the target is improved, so that the copper conductor which is prepared by using the target is low in electrical resistivity, membrane stress and surface roughness.

Description

technical field [0001] The invention relates to the field of sputtering targets, in particular to a method and a target for preparing a target for copper wires of a TFT-LCD array substrate. Background technique [0002] Liquid Crystal Display (LCD, Liquid Crystal Display) has many advantages such as thin body, power saving, no radiation, etc., and has been widely used. Most of the liquid crystal display devices on the market are backlight type liquid crystal displays, which include a liquid crystal display panel and a backlight module. The working principle of the liquid crystal display panel is to place liquid crystal molecules in two parallel glass substrates, and there are many vertical and horizontal thin wires between the two glass substrates. refracted to produce a picture. [0003] Usually a liquid crystal display panel consists of a CF (Color Filter) substrate, a TFT (Thin Film Transistor) substrate, and a liquid crystal (LC, Liquid Crystal) disposed between the CF...

AI Technical Summary

Problems solved by technology

[0006] The existing target material manufacturing process is generally: sintering→hot rolling / hot extrusion molding→annealing recovery recrystallization→machining, etc.; this process is not easy to control the crystal grains during hot rolling / hot extrusion molding and annealing recovery recrystallization Orientation, it is not easy to produce preferred crystal plane (111) orientation when preparing Cu thin film

see Figure 4 Schematic diagram of the surface roughness of the copper thin film formed by sputtering the copper target prepared by the conventional preparation method. The surface roughness Ra=2.73nm is relatively high, which is not conducive to the improvement of the quality of the TFT-LCD array substrate

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