SO8 plastic package sensor

Abstract

The invention relates to an SO8 plastic package sensor capable of achieving pressure detection. The sensor comprises a preliminary mould, a first lead frame and a second lead frame. A plastic package cover is arranged on the preliminary mould and is connected with a first pressure connection pipe. The first lead frame and the second lead frame are respectively integrated with the preliminary mould, and four pins stretch out of the two lead fames respectively. A pressure sensor chip is bonded to the bottom face of an inner cavity of the preliminary mould, and an integrated circuit chip is bonded to the surface of the second lead frame. The first lead frame, the pressure sensor chip, the integrated circuit chip and the second lead frame are mutually connected through gold wires. The SO8 plastic package sensor is characterized in that the preliminary mould and the plastic package cover are formed by adopting engineering plastic molding, the surfaces of the first lead frame and the second lead frame are plated by gold, and silica gel is filled in the inner cavity of the preliminary mould.

Description

technical field [0001] The invention relates to a plastic packaging sensor, in particular to an SO8 plastic packaging sensor capable of detecting gauge pressure, differential pressure and absolute pressure. Background technique [0002] Sensors are the most widely used electrical components in pressure detection operations. The current sensor manufacturing processes are mainly divided into three types: ceramic packaging, metal packaging and plastic packaging. Plastic packaging sensors are the most widely used due to their advantages in shape, weight, performance, cost and availability, and their ease of industrial automation. [0003] Existing plastic packaging sensors are mostly filled with epoxy resin in the inner cavity of the pre-molded mold. When curing, there is a large thermal stress inside the device, which leads to cracking of the molding compound, cracking of the surface passivation film, cracks at the interface, and reduced moisture resistance. Defects such as wa...

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Problems solved by technology

[0003] Existing plastic packaging sensors are mostly filled with epoxy resin in the inner cavity of the pre-molded mold. When curing, there is a large thermal stress inside the device, which leads to cracking of the molding compound, cracking of the surface passivation film, cracks at the interface, and reduced moisture resistance. Defects such as warping, which make the sensor's mechanical properties and thermal stability poor

[0004] In addition, the inner and outer pins of the lead frame of the existing plastic-encapsulated sensors are mostly silver-plated. Silver has poor oxidation resistance and is prone to precipitate hydrocarbons during high-temperature welding, thereby reducing the compactness of the coating and affecting welding. degraded performance and shorter service life

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