Manufacturing method of high-square-resistance solar cell
A solar cell and manufacturing method technology, which is applied to the manufacturing of circuits, electrical components, final products, etc., can solve the problems of reducing the yield of battery products, junction depth, etc. Effect
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[0014] The manufacturing method of the high square resistivity solar cell is different in that the present invention adopts the following steps: firstly, the suede surface is made on the surface of the silicon wafer by nitric acid, hydrofluoric acid mixed solution or sodium hydroxide solution. Through pre-diffusion treatment, a 35-65Ω / sqr emitter junction is fabricated on the surface of the silicon wafer, and the junction depth is 0.2-0.4μm. During this period, the silicon wafer can be cleaned with hydrochloric acid or hydrofluoric acid solution before the pre-diffusion treatment.
[0015] After that, wet etching or plasma etching equipment is used to remove the edge junction of the silicon wafer, and RCA solution is used to clean the silicon wafer. Specifically, if plasma etching equipment is used, 1-10% hydrofluoric acid solution cleaning is required before RCA solution cleaning.
[0016] Then, the silicon wafer is placed in a diffusion furnace for processing, so that the j...
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