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Method for synthesizing C-level polyurethane wire enamel

A technology of polyurethane paint and synthesis method, applied in the direction of polyurea/polyurethane coatings, coatings, etc., can solve the problems of restricting the development of electrical insulation industry, poor heat resistance, influence of physical properties of products, etc., and achieve good solderability and physical properties, The effect of high heat resistance and easy control of the reaction process

Active Publication Date: 2012-08-01
江苏四达特材科技有限公司 +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

So far, there are not many large-scale industrial production of polyurethane wire enamel in my country, and the main products are mainly F-grade (155°C) polyurethane wire enamel, which has a big gap with foreign countries, which seriously restricts the development of my country's electrical insulation industry. , in order to meet the market demand, aiming at the disadvantage of poor heat resistance of polyurethane wire enamel, it is necessary to develop C-grade high temperature resistant direct solderable polyurethane wire enamel
[0003] Chinese patent CN102140157A uses organosilicon polymer to modify polyurethane paint, which improves the performance of polyurethane paint in high temperature environment, but due to the addition of organosilicon polymer, the physical properties of the product have a certain impact

Method used

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  • Method for synthesizing C-level polyurethane wire enamel

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0019] Add metered tris-(2-hydroxyethyl)isocyanurate (1.0mol), N-methyldiethanolamine (6.5mol), 3,3 ', 4,4'-biphenyltetracarboxylic dianhydride (0.8mol) and catalyst zinc acetate, heated to 100-120°C, then added dimethyl terephthalate (5.2mol), stirred and dissolved, heated to 150 Reaction at ℃ for 4 hours, program temperature rise to 220℃ for reaction, when the temperature of the distillation head is lower than 60℃, carry out vacuum operation, the pressure first decreases and then increases, first slow and then fast, until the viscosity is between 950-1300mPas (25℃), stop the vacuum Operation, taking samples to measure acid value 2.49, hydroxyl value 147.1, adding measured cresol to dissolve until clarification.

[0020] Add a certain amount of diphenylmethane diisocyanate into a three-necked reaction flask equipped with a reflux condenser, a thermometer and a stirrer, add the same amount of DMF and stir to dissolve, add the catalyst tris-(dimethylaminomethyl)phenol, and heat...

Embodiment 2

[0023] Add metered tris-(2-hydroxyethyl)isocyanurate (1.0mol), N-methyldiethanolamine (6.5mol), 3,3 ',4,4'-benzophenonetetraacid dianhydride (0.8mol) and catalyst zinc acetate, heated to 100-120°C, then added dimethyl terephthalate (5.2mol), stirred and dissolved, heated to 150 Reaction at ℃ for 4 hours, program temperature rise to 220℃ for reaction, when the temperature of the distillation head is lower than 60℃, carry out vacuum operation, the pressure first decreases and then increases, first slow and then fast, until the viscosity is between 950-1300mPas (25℃), stop the vacuum Operation, take a sample to measure acid value 2.71, hydroxyl value 198.2, add metered cresol to dissolve until clarification.

[0024] With 160.1g of the above-mentioned polyester polyol, 700.2g of MDI trimer in Example 1, 850.1g of cresol, 430.2g of xylene, 201.1g of DMF, 35.1g of zinc isooctanoate, heated and stirred and mixed uniformly, obtained yellow transparent Lacquer liquid, solid content 3...

Embodiment 3

[0026] Add metered tris-(2-hydroxyethyl)isocyanurate (1.0mol), N-methyldiethanolamine (6.5mol), pyromellitic Formic acid dianhydride (0.8mol) and catalyst zinc acetate, heated to 100-120°C, then added dimethyl terephthalate (5.2mol), stirred to dissolve, heated to 150°C for 4 hours, programmed temperature rise to 220°C for reaction, When the temperature of the distillation head is lower than 60°C, carry out vacuum operation, the pressure first decreases and then increases, first slow and then fast, until the viscosity is between 950-1300mPas (25°C), stop the vacuum operation, take a sample to measure the acid value 1.35, the hydroxyl value 210.4 , add metered cresol to dissolve until clarified.

[0027] 150.1g of the above-mentioned polyester polyol, 800.2g of MDI trimer in Example 1, 851.1g of cresol, 433.2g of xylene, 204.1g of DMF, and 34.1g of zinc isooctanoate were heated and stirred evenly to obtain a yellow transparent Lacquer solution, solid content 32% (180°C / 2g / 1h),...

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Abstract

The invention discloses a method for synthesizing C-level polyurethane wire enamel. The C-level polyurethane wire enamel prepared by the method has high heat-resistant performance and solderability and physical performance, and the heat-resistant level reaches a C level. The method for synthesizing the C-level polyurethane wire enamel mainly comprises the following steps of: synthesizing polyester polyol, synthesizing a diphenylmethane diisocyanate (MDI) tripolymer and preparing polyurethane paint, wherein the polyester polyol is prepared by reacting dimethyl terephthalate, tri-(2-ethoxy) isocyanurate and dihydric alcohol which serve as raw materials under the action of a catalyst; and the dihydric alcohol is N-methyldiethanolamine, and part of dimethyl terephthalate is replaced by addingtetracarboxylic dianhydride for reaction.

Description

technical field [0001] The invention relates to a method for synthesizing polyurethane varnish, in particular to a method for synthesizing grade C polyurethane enameled wire varnish, which belongs to the field of electrical insulation. Background technique [0002] Enameled wire varnish is a large category of insulating varnish. It is a kind of special coating for coating wires, motors and electrical equipment. A layer of paint that can isolate the current. The paint film of wire enamel generally has good insulation, good heat resistance, good mechanical properties and good chemical resistance. Wire enamel is generally composed of film-forming substances and diluents. Film-forming substances include polyurethane resins, polyester resins, polyesterimide resins, epoxy resins, bismaleimide resins, silicone resins, etc. resin. Among them, polyurethane wire enamel has good direct soldering performance, so it is widely used in instrumentation and telecommunications industries, ...

Claims

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Application Information

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IPC IPC(8): C09D175/06C08G18/79C08G18/46C08G63/685
Inventor 张斌姚成林杰张建清孙兰娟张杏荣张衡伟
Owner 江苏四达特材科技有限公司
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