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LED (Light Emitting Diode) packaging structure using rear earth element doped transparent ceramic as base

A technology of LED packaging and transparent ceramics, which is applied in the direction of electrical components, circuits, semiconductor devices, etc., can solve the problems of reduced reflectance of light bands, accelerated light decay, yellowing and discoloration of metal Ag films, etc., and achieves the effect of high insulation

Inactive Publication Date: 2012-07-11
FUJIAN INST OF RES ON THE STRUCTURE OF MATTER CHINESE ACAD OF SCI
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Problems solved by technology

But this brings another problem. The metal Ag thin film is easy to turn yellow and change color under the high temperature of the lit LED chip, resulting in a decrease in the reflectivity of the light band, resulting in a decrease in the luminous efficacy and color rendering index of the packaged LED, and accelerating the development of the LED. light decay

Method used

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  • LED (Light Emitting Diode) packaging structure using rear earth element doped transparent ceramic as base
  • LED (Light Emitting Diode) packaging structure using rear earth element doped transparent ceramic as base
  • LED (Light Emitting Diode) packaging structure using rear earth element doped transparent ceramic as base

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Embodiment Construction

[0027] Prepared by injection molding or slip casting or isostatic pressing figure 2 and image 3 Doped Ce 2 o 3 The YAG transparent ceramic base 10 with an atomic percentage of 0.15% is sintered at high temperature in vacuum or in an atmosphere. The transmittance of ceramics in the region greater than the wavelength of green light is greater than 80%, and the transmittance curve is as follows Figure 5 shown. On the prepared ceramic base, photolithography and magnetron sputtering techniques are used to form such as figure 2 and image 3 Patterned copper metal electrodes 501 and 502 are shown.

[0028] The blue light LED chip 20 is fixed on the YAG ceramic base 20 by using a crystal bonding machine and a transparent crystal bonding glue 201. The dominant wavelength of the chip is 430-435nm, and at 150 o Bake in an oven at C for 2 hours to cure the die-bonding glue.

[0029] Using a gold wire machine and gold wire 30, the positive and negative electrodes of the LED chi...

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Abstract

The invention relates to an LED (Light Emitting Diode) packaging structure using rear earth element-doped transparent ceramic as a base and emitting white light from two sides. The LED packaging structure is characterized in that: an LED chip (20) is arranged on the surface of the transparent ceramic base (10) through a solid phase crystallization manner and is electrically connected with patterned electrodes (501 and 502); and phosphor-mixed transparent silica gel or epoxy resin glue (40) is covered on the base (10) and the LED chip (20). Through the LED packaging scheme, blue light emitted from the back and side of the LED chip to the base can be absorbed by YAG (Yttrium Aluminum Garnet) ceramic, then converted into white light and emitted out from the back, so that the LED packaging structure emitting white light from the two sides is formed.

Description

technical field [0001] The invention relates to a novel LED package base, in particular to a novel package structure and light output mode of a white LED. Background technique [0002] As a new type of light source, LED has achieved unprecedented development due to its incomparable advantages such as energy saving, environmental protection, long life, fast start-up speed, controllable luminous spectrum and forbidden band size to make the color higher than traditional light sources. [0003] Generally speaking, the traditional white LED packaging structure, such as figure 1 , is mainly provided with a base A with a groove A1, a chip B is combined in the groove A1, and the chip B is connected with another support D through a connecting line C, and finally through the injection molding of a light-transmitting layer E , the base A, the chip B, the connecting wire C and another bracket D are combined into one body to complete the packaging of the LED. [0004] However...

Claims

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Application Information

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IPC IPC(8): H01L33/48H01L33/64C04B35/44C04B35/622
CPCH01L2224/45124H01L2224/45144H01L2224/48227
Inventor 曹永革刘著光黄秋凤邓种华王充兰海王方宇王文超
Owner FUJIAN INST OF RES ON THE STRUCTURE OF MATTER CHINESE ACAD OF SCI
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