Manufacturing method and structure of long-distance radio frequency identification metal product

Abstract

The invention discloses a manufacturing method and a structure of a long-distance radio frequency identification metal product. Ultrahigh-frequency radio frequency identification (UHF RFID) can be applied to various metal products without interference; electromagnetic waves emitted by an emitter are received by a metal primary antenna on the metal product; by utilizing a resonant cavity in the metal primary antenna and a secondary antenna of an electronic tag module patch, resonance and sensing are generated to transmit a signal to a radio frequency identification (RFID) wafer so as to achieve a long-distance reading and sending effect; when fragment cutting lines at the position of the secondary antenna are disassembled, the secondary antenna is damaged and loses efficacy; the electronic tag module patch is bound by an adhesive and sealed in the metal primary antenna; if the electronic tag module patch is disassembled, the effect that the secondary antenna is damaged and loses efficacy can also be caused, so that the metal product has an RFID function and also has an anti-copy efficacy.

Description

technical field [0001] The invention relates to a long-distance radio frequency identification metal product manufacturing method and structure which is free from metal interference, has long-distance reading and sending effects, and has anti-copy and anti-copy effects. Background technique [0002] Radio Frequency Identification (RFID) technology has been widely used in many fields such as industrial automation, commercial automation, and traffic control management. More and more researches have begun to study the ultra-high frequency (UHF) RFID system in order to realize the characteristics of the system such as long-distance, high efficiency, and low cost. Because RFID has the advantages of non-contact, low cost, high anti-counterfeiting and low cost in mass production, it has gradually replaced the traditional two-dimensional barcode. Currently on the market, radio frequency identification (RFID) is also widely used in many fields such as identification, access control,...

AI Technical Summary

Problems solved by technology

The distance H between the former electronic tag and the metal surface should be kept at a height of more than 2.5mm. Although this improves the reading distance of the electronic tag, it will increase the volume cost of the entire tag and reduce the bandwidth of the antenna. It does not really solve the problem. The impact of surface metal on the electronic tag antenna, so the current traditional electronic tag antenna is almost used on non-metallic surfaces, such as the design of ETC in Taiwan, China, and the general identification tag TAG

The latter, the technology of combining the slotting method with the electronic tag, will have great problems in terms of reliability and flatness, especially the joint between the chip and the metal point, due to the characteristics of metal thermal expansion and cold contraction, it will cause problems for a long time. The joints fall off, and with this design, since each piece of metal antenna must be impedance-matched with the chip (if there is no matching, it will easily cause frequency deviation or field shape changes), including the difficult handling of the joints (generally using conductive glue, Copper laying, electroplating copper, vacuum sputtering copper, etc.), using conductive glue, because it is easy to have life and temperature reliability problems, the life of conductive glue is about 2 to 5 years at room temperature, and the conductive substance in the glue is oxidized. After curing, the bonding layer between the conductive material and the material has a certain resistance value. The cumulative resistance value of many conductive materials will cause the VF value to rise, resulting in excessive frequency offset and field shape variability, resulting in difficulty in controlling the degree of control; caused by copper laying methods The problem is slightly the same as the method of using conductive adhesive; the electroplating copper method also has the risk of peeling due to the different expansion coefficients of aluminum and copper materials; even though vacuum sputtering is much more stable in bonding than electroplating copper, it is still in the product. The volume is large, and the cost of implementation is too high when the splash range is small. In addition, the existing slotting method combined with electronic tags usually does not have the protection of high temperature resistance, impact resistance (scratch), water resistance, anti-theft, and acid and alkali resistance.

[0004] As for the ceramic boundary value microstrip antenna, although it can also be used on the metal surface, it uses the high dielectric constant of the ceramic medium to minimize the volume of the antenna, and uses the metal surface as a larger reflection surface to improve the performance of the antenna. Stable and increase directivity, but due to the high cost of ceramic antennas, it is not suitable for low-cost mass production of electronic tags; another electronic tag antenna solution applied to metal surfaces is to increase the antenna between the antenna radiation surface and the metal surface A layer of AMC magnetic conductor structure, through the high impedance characteristics of the AMC magnetic conductor, the direction of the magnetic flow generated between the electronic tag and the AMC magnetic conductor is the same as the direction of the magnetic flow between the metal surface and the AMC magnetic conductor, thereby improving the gain of the electronic tag and reading distance, but due to the difficulty and high cost of current research on this technology, it is still in the experimental stage

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