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Method for manufacturing thick polyimide flexible metal-clad laminate

A technology of metal-clad laminates and polyimide layers is applied in the field of preparation of polyimide thick-film flexible metal-clad laminates, which can solve the problems of difficulty in preparation, foaming and the like, and achieve the effect of low production cost.

Inactive Publication Date: 2012-07-04
NEXFLEX CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, if the thickness of the polyimide is increased, the phenomenon of blistering and curling of the film will occur frequently during the evaporation of the solvent contained in the polyamic acid varnish, making the production difficult

Method used

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  • Method for manufacturing thick polyimide flexible metal-clad laminate
  • Method for manufacturing thick polyimide flexible metal-clad laminate
  • Method for manufacturing thick polyimide flexible metal-clad laminate

Examples

Experimental program
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Effect test

Synthetic example 1

[0069] In a nitrogen atmosphere, 12,312 g of diamine-based PDA and 2,533 g of ODA were added and stirred to 211,378 g of DMAc solution, and after complete dissolution, 38,000 g of BPDA as an acid anhydride was added in portions. After that, the stirring was continued for about 24 hours to prepare a polyamic acid solution. The prepared polyamic acid solution was cast into a film with a thickness of 20 μm, the temperature was raised to 350° C. for 60 minutes, and then kept for 30 minutes to harden. The measured coefficient of linear thermal expansion was 13.0 ppm / K.

Synthetic example 2

[0071] In a nitrogen atmosphere, 3,063 g of diamine-based PDA and 2,431 g of ODA were added to 117,072 g of DMAc solution, stirred, and after complete dissolution, 12,000 g of BPDA as an acid anhydride was added in portions. After that, the stirring was continued for about 24 hours to prepare a polyamic acid solution. The prepared polyamic acid solution was cast into a film with a thickness of 20 μm, the temperature was raised to 350° C. for 60 minutes, and then kept for 30 minutes to harden. The measured linear coefficient of thermal expansion was 25.1 ppm / K.

Synthetic example 3

[0073] In a nitrogen atmosphere, 948 g of diamine-based BAPB was added to 11,572 g of DMAc solution, stirred, and 757 g of bisanhydride BPDA was added after completely dissolving. After that, the stirring was continued for about 24 hours to prepare a polyamic acid solution. The thus-prepared polyamic acid solution was cast into a film with a thickness of 20 μm, the temperature was raised to 350° C. for 60 minutes, and then kept for 30 minutes to harden. The measured coefficient of linear thermal expansion was 65.1 ppm / K.

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Abstract

The invention relates to a method for manufacturing a thick polyimide flexible metal-clad laminate. Provided is the method for manufacturing a flexible metal-clad laminate using a casting method, including: (a) forming a first polyimide layer having a coefficient of linear thermal expansion of 25 ppm / K or less above a metal layer; (b) plasma-treating a surface of the first polyimide layer; and (c) forming a second polyimide layer having a coefficient of linear thermal expansion of 25 ppm / K or lower above the first polyimide layer. The flexible metal-clad laminate according to the present invention can have excellent adhesion between the polymer film and the metal conductive layer, a low dimensional change, and a low production cost, because of superior casting workability, even though the thickness of polyimide becomes increased.

Description

technical field [0001] The present invention relates to a method for preparing a flexible metal-clad laminate, and more specifically, the method for preparing a flexible metal-clad laminate prepares a whole polyimide thickness When the product is thicker than 30 μm, the preparation process is easy to operate, and the obtained laminate has excellent adhesion between the polymer film and the metal conductive layer, and the dimensional change rate is low. Background technique [0002] A printed circuit board (PCB; Printed Circuit Board) is a graphical representation of the electrical wiring connecting various components according to the circuit design, which can connect or support various components. Such printed circuit boards can be divided into rigid printed circuit boards, flexible printed circuit boards, rigid-flexible printed circuit boards combining the above two, and rigid-flexible printed circuit boards according to their physical characteristics. Circuit boards are s...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B32B37/15
CPCB32B15/08B32B15/088B32B2037/243B32B2457/20B32B2311/00C08J7/00B32B2379/08B32B2307/538Y10T428/265Y10T428/31681B05D3/148
Inventor 赵柄旭金澔燮金永道崔元重金大年
Owner NEXFLEX CO LTD
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