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Anti-bonding copper infiltration powder and preparation method thereof

An anti-adhesion, copper powder technology, applied in the field of powder metallurgy, can solve the problems of large batches of defective products, low efficiency, corrosion holes and cracks, etc., to achieve the effect of clean and beautiful surface, simple process flow, and improved material performance

Inactive Publication Date: 2012-07-04
有研科技集团有限公司 +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

There are a lot of residues and corrosion holes and cracks on the surface of low-end copper infiltration powder after copper infiltration, resulting in a large number of defective products, which require subsequent processing
The conventional copper infiltration method currently used in the industry is to place the green body of copper infiltration powder (without adding anti-adhesion additives) on the top of the parts for single-layer infiltration. Low production efficiency
If the parts are stacked up and down, and conventional copper infiltration powder is placed in the middle, after the copper infiltration is completed, the molten copper infiltration powder will firmly weld the two parts together, so that the parts cannot be separated
Conventional copper infiltrating powder has low efficiency and high energy consumption for single-layer infiltration copper infiltration. With the development of powder metallurgy industry, manufacturers are pursuing high efficiency and low cost. Conventional copper infiltration powder and copper infiltration methods are suitable for some Copper products show certain incompatibility

Method used

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  • Anti-bonding copper infiltration powder and preparation method thereof
  • Anti-bonding copper infiltration powder and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0022] A kind of anti-bonding copper penetration powder, component is Cu-1.5Fe-1.8Zn+3%MgO, raw material is: atomized copper powder (-100 mesh), superfine iron powder (-800 mesh), CuZn20 powder ( -250 mesh); the anti-adhesive additive is MgO powder, the particle size is -100 mesh, -325 mesh <15%, and the added mass percentage is 3%.

[0023] A preparation method of copper infiltrating powder, the method steps are as follows:

[0024] (1) Weigh 89.5kg of atomized copper powder, 1.5kg of superfine iron powder, and 9kg of CuZn20 powder, add 5kg of ceramic balls, and mix in a mixer for 0.5h;

[0025] (2) After the mixing process is completed, the powder is sent to the hydrogen reduction furnace for diffusion. The diffusion temperature is 650°C and the diffusion time is 1.7h. The hydrogen reduction furnace is an ammonia decomposition and reduction atmosphere, and the ratio of hydrogen to nitrogen is 3:1. ;

[0026] (3) Circulating water cooling, furnace crushing, 100 mesh sieve c...

Embodiment 2

[0029] An anti-adhesive copper penetration powder, the composition is Cu-1.8Fe-2.0Zn+5%SiO 2 , atomized copper powder (-100 mesh), ultra-fine iron powder (-800 mesh), CuZn30 powder (-250 mesh), anti-adhesive additive is SiO 2 powder, the particle size is -100 mesh, -325 mesh <15%, and the mass percentage is 5%.

[0030] A preparation method of copper infiltrating powder, the method steps are as follows:

[0031] (1) Weigh 91.53kg of atomized copper powder, 1.8kg of superfine iron powder, and 6.67kg of CuZn30 powder, add 5kg of ceramic balls, and mix in a mixer for 0.8h;

[0032] (2) After the mixing process is completed, the powder is sent to a hydrogen reduction furnace for diffusion. The diffusion temperature is 660° C., the diffusion time is 1.5 h, and the ammonia decomposition reduction atmosphere is used. The ratio of hydrogen to nitrogen is 3:1;

[0033] (3) Circulating water cooling, furnace crushing, 100 mesh sieve collection, then add 5.26kg of SiO 2 powder and 0.5...

Embodiment 3

[0036] An anti-adhesive copper infiltration powder, the composition is Cu-1.3Fe-2.5Zn+7%Al 2 o 3 , atomized copper powder (-100 mesh), ultra-fine iron powder (-800 mesh), CuZn20 powder (-250 mesh), anti-adhesive additive is Al 2 o 3 powder, the particle size is -100 mesh, -325 mesh <15%, and the mass percentage is 7%.

[0037] A preparation method of copper infiltrating powder, the method steps are as follows:

[0038] (1) Weigh 86.2kg of atomized copper powder, 1.3kg of superfine iron powder, and 12.5kg of CuZn20 powder, add 5kg of ceramic balls, and mix in a mixer for 1 hour;

[0039] (2) After the mixing process is completed, the powder is sent into a hydrogen reduction furnace for diffusion, the diffusion temperature is 720°C, the diffusion time is 1h, the ammonia decomposition reduction atmosphere, and the ratio of hydrogen to nitrogen is 3:1;

[0040] (3) Circulating water cooling, furnace crushing, 100 mesh sieve collection, then add 7.53kg of Al 2 o 3 powder and ...

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Abstract

The invention discloses anti-bonding copper infiltration powder and a preparation method thereof and belongs to the technical field of powder metallurgy. The anti-bonding copper infiltration powder is composed of raw materials, an anti-bonding additive and a lubricating agent, wherein the raw materials are composed of the following components by weight percent: 0.5-3.8% of iron powder, 1.5-18% of brass powder and the balance of copper powder; the addition of the anti-bonding additive is 2-15% of the weight of the raw materials; and the addition of the lubricating agent is 0.5% of the weight of the raw materials. An anti-bonding matter is added in the copper infiltration powder prepared by the preparation method disclosed by the invention, so that the copper infiltration overlying is realized. The anti-bonding copper infiltration powder has better forming property. During a use process, the copper infiltration parts can be stacked and placed in multiple layers, the products are not corroded and the strength of the products is obviously increased. After the copper infiltration is ended, the contact surfaces of the products are not bound mutually; only an incompact oxide interlayer which can be easily removed is arranged on the surface; the surface of the parts is clean and beautiful; the copper infiltration efficiency of the parts is greatly increased; and the capacity is increased.

Description

technical field [0001] The invention relates to an anti-bonding copper infiltration powder and a preparation method thereof, belonging to the technical field of powder metallurgy. Background technique [0002] At present, due to its low cost and easy processing, powder metallurgy parts are used more and more in industry, but the residual pores inside the parts greatly affect the performance of the parts, and the powder metallurgy copper infiltration process is a common Under pressing pressure, it can effectively reduce porosity and obtain high-density parts. The density, hardness, impact toughness and processability of parts prepared by copper infiltration method are much higher than those of traditional densification processes such as warm pressing, repressing and refiring. And the cost is low, which is a cost-effective method. There are a lot of residues and corrosion holes and cracks on the surface of low-end copper infiltration powder after copper infiltration, resultin...

Claims

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Application Information

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IPC IPC(8): B22F3/24B22F1/00
Inventor 徐景杰王林山汪礼敏张景怀刘宇惠刘一浪
Owner 有研科技集团有限公司
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