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Double-component epoxy structural adhesive and preparation method thereof

An epoxy structural adhesive, two-component technology, applied in the direction of epoxy resin glue, adhesive, non-polymer adhesive additives, etc., can solve the problem of glue shortage in the bonding part, achieve sufficient operating time, good effect, Clean operating environment

Inactive Publication Date: 2012-04-11
BEIJING QINGDA SUNKIST NEW MATERIAL TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Although the shear strength of the heat-cured epoxy structural adhesive can reach more than 20MPa, during the heating process, due to the large decrease in the viscosity of the glue, the glue will flow, which will easily cause the lack of glue in the bonding part.

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0031] A two-component epoxy structural adhesive, consisting of component A and component B, wherein the ratio of component A to component B is 1:1 by weight.

[0032] The component content of A component is 100 parts by weight of modified bisphenol A epoxy resin and 75 parts of active filler active filler active silicon micropowder HGH600, and the component content of B component is 30 parts by weight Parts of modified fatty amine QS-3950, 20 parts of toughening agent QS-030N, 5 parts of coupling agent silane coupling agent KH550, 120 parts of thixotropic filler silica powder 8A-1.

[0033] The preparation method of the modified bisphenol A epoxy resin is as follows: 85 parts by weight of 128 resin, 10 parts of 134 resin and 5 parts of toughening agent QS-030N are reacted at 100° C. for 1 hour.

[0034] The preparation method of above-mentioned a kind of two-component epoxy structural glue, comprises the following steps:

[0035] (1) Preparation of component A: React 85g of ...

Embodiment 2

[0040] A two-component epoxy structural adhesive, consisting of component A and component B, wherein the ratio of component A to component B is 1:1 by weight.

[0041] The component content of A component is 100 parts by weight of modified bisphenol A epoxy resin and 50 parts of active filler active filler active silicon micropowder HGH600, and the component content of B component is 35 parts by weight Parts of modified fatty amine QS-3950, 20 parts of toughening agent QS-030N, 2.5 parts of coupling agent silane coupling agent KH550, 92.5 parts of thixotropic filler silica powder 8A-1.

[0042] Wherein, the preparation method of the modified bisphenol A epoxy resin is: 75 parts by weight of 128 resin, 15 parts of 134 resin and 10 parts of toughening agent QS-030N are reacted at 100° C. for 1 hour.

[0043] The preparation method of above-mentioned a kind of two-component epoxy structural glue, comprises the following steps:

[0044] (1) Preparation of component A: React 75kg ...

Embodiment 3

[0049] A two-component epoxy structural adhesive, consisting of component A and component B, the proportion of component A and component B is 1:1 by weight, and the content of component A is by weight parts It is 100 parts of modified bisphenol A epoxy resin and 60 parts of active filler active filler active silicon micropowder HGH600, the component content of B component is 40 parts of modified fatty amine QS-3950, 15 parts of toughening Agent QS-030N, 5 parts of coupling agent silane coupling agent KH550, 100 parts of thixotropic filler silica powder 8A-1.

[0050] The preparation method of the modified bisphenol A epoxy resin is as follows: in parts by weight, 85 parts of epoxy resin 128, 10 parts of epoxy resin 134 and 5 parts of toughening agent QS-030N are reacted at 100° C. for 1 hour.

[0051] The preparation method of above-mentioned a kind of two-component epoxy structural glue, comprises the following steps:

[0052] (1) Preparation of component A: react 85g of epo...

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Abstract

The invention provides a double-component epoxy structural adhesive and a preparation method thereof. The structural adhesive is prepared from a component A and a component B in a weight ratio of 1:1, wherein the component A comprises 100 parts by weight of modified bisphenol A epoxy resin and 40-100 parts by weight of active filler; and the component B comprises 30-40 parts by weight of modified fatty amine, 10-25 parts by weight of toughener, 1.5-5 parts by weight of coupling agent and 75-140 parts by weight of thixotropic filler. The double-component epoxy structural adhesive is curable at normal temperature, can be cured quickly at moderate temperature, and can be completely cured at 80 DEG C within 1 hour or at 100 DEG C within half an hour. The adhesive has thixotropy, and the adhesive liquid does not flow when being cured at normal temperature and raised temperature; and the double-component epoxy structural adhesive has the advantages of shock resistance, vibration resistance and high bonding strength, and has favorable effects on bonding glass fiber reinforced plastics, steel, aluminum and other metal profiles.

Description

technical field [0001] The invention relates to a two-component epoxy structural adhesive and a preparation method thereof, belonging to the field of polymer material synthesis and processing. Background technique [0002] Generally, epoxy structural adhesives cured at room temperature need to be cured for 24-48 hours at 25°C to achieve complete curing. If the curing temperature is low, the curing time will take a long time, sometimes as long as 7 days. For epoxy structural adhesives cured at room temperature, the shear strength of steel-steel specimens is relatively low, generally lower than 20MPa. In order to achieve the purpose of fast curing, it needs to be heated to a certain temperature. At a medium temperature of 80-100 ° C, it takes 4-5 hours to cure. At a higher temperature of 150°C, it will take 1-2 hours to cure completely. Although the shear strength of the heat-cured epoxy structural adhesive can reach more than 20MPa, during the heating process, due to the la...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J163/02C09J11/04C09J11/06
Inventor 甘常林
Owner BEIJING QINGDA SUNKIST NEW MATERIAL TECH
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