Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Cleaning process for high-density interconnected printed circuit board (HDI PCB)

A printed circuit board and high-density interconnection technology, which is applied in the secondary processing of printed circuits, cleaning/polishing of conductive patterns, etc., to avoid the risk of wedge-shaped hole breakage, improve production efficiency and turnover rate, and save production costs.

Active Publication Date: 2012-01-04
GULTECH WUXI ELECTRONICS CO LTD
View PDF8 Cites 6 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0009] Thus there is a potential quality risk - the formation of wedge-shaped holes

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0024] For the cleaning of high-density interconnected printed circuit boards used in mobile phones and digital cameras, the diameter of the blind hole is 0.127mm (5mil). The specific cleaning process is as follows:

[0025] a. The use pressure is 50kg / cm 2 Clean the surface and blind holes of high-density interconnected printed circuit boards with clean water at room temperature;

[0026] b. Put the high-density interconnected printed circuit board of step a into the ultrasonic cleaning tank. The ultrasonic cleaning tank wall is equipped with an ultrasonic generator. The ultrasonic frequency is 23KHz. The current of the ultrasonic generator is 2.0A. The power of the ultrasonic generator is 1200W, a total of four ultrasonic generators are installed in the ultrasonic cleaning tank, the water temperature in the ultrasonic cleaning tank is controlled at 35 ℃, and the ultrasonic cleaning time is 1 minute;

[0027] c. Use the high-density interconnected printed circuit board of s...

Embodiment 2

[0036] For the cleaning of high-density interconnected printed circuit boards used in mobile phones and digital cameras, the diameter of the blind hole is 0.127mm (5mil). The specific cleaning process is as follows:

[0037] a. The use pressure is 70kg / cm 2 Clean the surface and blind holes of high-density interconnected printed circuit boards with clean water at room temperature;

[0038] b. Put the high-density interconnected printed circuit board of step a into the ultrasonic cleaning tank. The ultrasonic cleaning tank wall is equipped with an ultrasonic generator. The ultrasonic frequency is 33KHz. The current of the ultrasonic generator is 3.0A. The power of the ultrasonic generator is 1200W, a total of four ultrasonic generators are installed in the ultrasonic cleaning tank, the water temperature in the ultrasonic cleaning tank is controlled at 45 ℃, and the ultrasonic cleaning time is 3 minutes;

[0039] c. Use the high-density interconnected printed circuit board of ...

Embodiment 3

[0048] For the cleaning of high-density interconnected printed circuit boards used in mobile phones and digital cameras, the diameter of the blind hole is 0.127mm (5mil). The specific cleaning process is as follows:

[0049] a. The use pressure is 60kg / cm 2 Clean the surface and blind holes of high-density interconnected printed circuit boards with clean water at room temperature;

[0050]b. Put the high-density interconnected printed circuit board in step a into the ultrasonic cleaning tank. The ultrasonic cleaning tank wall is equipped with an ultrasonic generator. The ultrasonic frequency is 28KHz. The current of the ultrasonic generator is 2.5A. The power of the ultrasonic generator is 1200W. There are four ultrasonic generators installed in the ultrasonic cleaning tank. The water temperature in the ultrasonic cleaning tank is controlled at 40°C, and the ultrasonic cleaning time is 2 minutes;

[0051] c. Use the high-density interconnection printed circuit board of step ...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention discloses a cleaning process for a high-density interconnected printed circuit board (HDI PCB). The process comprises the following steps of: cleaning with clean water at normal temperature under high pressure; cleaning with ultrasonic waves; cleaning with clean water at normal temperature under low pressure; cleaning with micro etching fluid; cleaning with clean water at normal temperature under low pressure; cleaning with dilute sulphuric acid; cleaning with clean water at normal temperature under low pressure; performing natural wind drying at normal temperature under high pressure; roasting and the like. By the process, a blind hole cleaning effect is ensured, the production efficiency and the turnover rate are improved, board surface scratching scrap in the transporting process is effectively reduced, and risks of wedge voids are avoided, so that the production cost is saved.

Description

technical field [0001] The invention discloses a cleaning process for a high-density interconnected printed circuit board. Background technique [0002] For high-density interconnected printed circuit boards (HDI PCB boards), after laser drilling, the glue residue in the holes is removed by chemical methods, and finally washed and dried in the washing section, and then the blindness is inspected by laser AOI (automatic optical inspection equipment) equipment. Whether the bottom of the hole is clean or not, and whether the blind hole is missed, broken down, and other quality conditions. [0003] Process: laser drilling → chemical removal of glue ( [注1] Specifically: fluffing agent fluffing → water washing → sodium permanganate corrosion → water washing → hydrogen peroxide, sulfuric acid pre-neutralization → water washing → special neutralizing agent to clean the residual sodium permanganate → water washing) → washing machine washing and drying → automatic optical detection....

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): H05K3/26
Inventor 严冬娟
Owner GULTECH WUXI ELECTRONICS CO LTD
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com