Copper-Containing Fixed Abrasive Abrasive Polishing Pads

A technology for consolidating abrasives and polishing pads, applied in abrasives, metal processing equipment, manufacturing tools, etc., can solve the problems of affecting the precision of the processed surface, insufficient rigidity of the grinding and polishing pads, reducing the processing efficiency, etc. The effect of improving self-dressing ability and improving processing efficiency

Inactive Publication Date: 2011-12-07
NANJING UNIV OF AERONAUTICS & ASTRONAUTICS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The object of the present invention is to invent a copper-containing solid resin pad with high rigidity and self-repairing function, aiming at the problems that the grinding and polishing pads in the existing processing process are not rigid enough and need to be trimmed continuously, which affects the surface shape accuracy of the processing and reduces the processing efficiency. knot abrasive polishing pad

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0018] Example 1: A kind of copper-containing fixed abrasive abrasive polishing pad, it is by 350g grain size be the diamond abrasive of 40 microns, 150g grain size is the atomized pure copper powder of 20 microns and 500g resin (can adopt exactly the same as used in the existing polishing pad Resins, such as hydrophilic resins, can also be realized by using the resin formulations used in the applicant's previous application numbers of 2007100248219, 2008102440960, 2008100227414, 2009102135958, 201010145260X, the same below) to form after uniform mixing and curing. Existing polishing pads are the same. The key point of the present invention is that copper powder is added to the polishing pad, and the remaining components are basically the same as the prior art except for the proportioning relationship. The surface shape of K9 glass processed by the abrasive polishing pad is increased by 100%, the material removal rate is increased by 300%, and the self-repairing ability is in...

Embodiment 2

[0019] Example 2: The invention discloses a copper-containing consolidated abrasive grinding and polishing pad, which is formed by uniformly mixing abrasive, copper powder and resin and curing, and its preparation method is the same as that of the existing polishing pad. The abrasive is 200g of cerium oxide, the copper powder is 250g of pure copper powder, and the resin is 550g. The key point of the present invention is that copper powder is added to the polishing pad, and the remaining components are basically the same as the prior art except for the proportioning relationship. The particle size of cerium oxide is 10 microns, and the particle size of pure copper powder is 10 microns. The surface shape of K9 glass made of grinding and polishing pad is increased by 150%, the material removal rate is increased by 200%, and the self-repairing ability is increased by 60 times. Grinding and polishing monocrystalline silicon wafers, the surface shape is improved by 50%, the mater...

Embodiment 3

[0020] Example 3: A copper-containing fixed abrasive grinding and polishing pad, which is formed by uniformly mixing abrasives, copper powder and resin, and curing, and its preparation method is the same as the existing polishing pad, wherein the abrasive is 400g of silicon carbide, and the copper powder is brass powder 150g: 450g of resin. The key point of the present invention is that copper powder is added to the polishing pad, and the remaining components are basically the same as the prior art except for the proportioning relationship. The particle size of the silicon carbide is 50-60 microns, and the particle size of the brass powder is 20 microns. Made into grinding and polishing pads, the surface shape of K9 glass is improved by 50%, the material removal rate is increased by 300%, and the self-repairing ability is increased by 40 times. Grinding and polishing monocrystalline silicon wafers, the surface shape is improved by 40%, the material removal rate is increased...

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Abstract

A copper-containing consolidated abrasive grinding and polishing pad is characterized in that it is mainly composed of abrasives, copper powder and resin uniformly mixed and solidified, and the mass percentage of the abrasive, copper powder and resin is abrasive: copper powder: resin = 5 %-50%: 0.1%-30%: 20%-90%. The invention is beneficial to improve the rigidity of the grinding and polishing pad, and improve the surface shape precision of the workpiece; cooperate with the grinding and polishing liquid, improve the self-repairing ability of the grinding and polishing pad, facilitate the long-term continuous processing process, and improve the processing efficiency and the surface quality of the workpiece.

Description

technical field [0001] The invention relates to a finishing tool, in particular to a grinding and polishing pad for grinding and polishing, in particular to a resin-containing copper-containing solidified abrasive grinding and polishing pad. Background technique [0002] It is predicted that the scale of the global LED lighting market will reach US$12 billion in 2012, and the demand for handheld household appliances will grow strongly. Therefore, the market for sapphire substrate materials and glass display screens is optimistic. The United States, China and other countries have successively launched nuclear fusion power generation projects. Among them, only in the "National Ignition Project" of the United States, the amount of optical components has reached more than 40,000. Optical components are also widely used in weapon precision guidance systems, space remote sensing systems, and all-solid-state lasers. display and medical systems, etc. Among the above products, a lar...

Claims

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Application Information

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IPC IPC(8): B24D3/34B24D3/00
Inventor 朱永伟李军左敦稳叶剑锋樊吉龙孙玉利
Owner NANJING UNIV OF AERONAUTICS & ASTRONAUTICS
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