A kind of high temperature resistant modified epoxy resin adhesive and preparation method thereof

A technology of epoxy resin and adhesive, which is applied in the direction of epoxy resin glue, adhesive, carboxyl rubber adhesive, etc. It can solve the problems of unsatisfactory high-temperature bonding performance, unsatisfactory thermal oxidation stability, and unsuitability for large-area bonding. , to achieve high practical value, moderate viscosity and low brittleness

Inactive Publication Date: 2011-11-30
DONGHUA UNIV +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Polyimide adhesives can generally be divided into the following categories: 1. Condensed polyimide adhesives, which are the earliest developed type of polyimide adhesives, but due to the formation of water molecules during the curing reaction of polyamic acid , is easy to cause defects, and is not suitable for large-area bonding; 2. Thermoplastic polyimide adhesive, which is a type of adhesive that can be heated and melted to bond materials, but its Tg is low, generally not exceeding 250 ° C, so High-temperature bonding performance is not ideal; 3. Addition-type polyimide adhesives, typical addition-type polyimide adhesives mainly include norbornene-based and phenylethynyl-terminated polyimide adhesives
However, the curing process of the former needs to be pressurized, and the thermal oxidation stability is not ideal, and the toughness of the cured product is low.
The latter cures without pressure, but the curing temperature is high

Method used

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  • A kind of high temperature resistant modified epoxy resin adhesive and preparation method thereof
  • A kind of high temperature resistant modified epoxy resin adhesive and preparation method thereof
  • A kind of high temperature resistant modified epoxy resin adhesive and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0029] Add 0.1 mole (33.6 grams) of 3,5-bis(4-aminophenoxy)benzoic acid and 300 milliliters of N,N-dimethylacetamide as a highly polar aprotic organic solvent into the polymerization bottle, stir Dissolve, add 0.1 mole (31.0 g) of 3,3',4,4'-tetracarboxylic diphenyl ether dianhydride powder, and react at 0°C-10°C for 5-10 hours to obtain a transparent PAA solution, add 300 ml of toluene azeotropic dehydration agent, then heat azeotropic dehydration until the azeotropic dehydration is complete, about 6 hours, then heat the reaction system to distill and concentrate to about 1 / 3, stir and precipitate in acetone at a high speed to prepare The obtained carboxyl group-containing polyimide CPI-1 powder has an intrinsic viscosity of 0.62 dL / g (25°C, concentrated sulfuric acid).

[0030] Using 3,3',4,4'-tetracarboxylic benzophenone dianhydride, 1,4-bis(3,4-dicarboxyphenoxy)phthalic anhydride, 2,2-bis[4-(3 , the aromatic dianhydride of 4-dicarboxyphenoxy) phenyl] propane dianhydride re...

Embodiment 2

[0035] TGDDM epoxy resin: 58.0 grams

[0036] CTBN carboxy-terminated nitrile rubber: 6.75 grams

[0037] CPI-4 powder: 1.0 g

[0038] Dicyandiamide curing agent: 4.0 grams

[0039] 1,3-Diglycidyloxybenzene diluent: 30.25 grams

[0040] Stir the above ingredients evenly at room temperature to obtain the carboxyl-containing polyimide modified epoxy adhesive. Its use effect can reach the purpose of the invention.

Embodiment 3

[0042] ES216 epoxy resin: 56.8 grams

[0043] CTBN carboxy-terminated nitrile rubber: 6.6 grams

[0044] CPI-3 powder: 3.0 grams

[0045] 2-ethyl-4-methylimidazole curing agent: 1.8 grams

[0046] Dicyandiamide curing agent: 2.15 grams

[0047] 2,2-bis(4-glycidyloxycyclohexyl)propane diluent: 15.2 grams

[0048]Vinyl cyclohexene dioxide thinner: 14.46 grams

[0049] Stir the above ingredients evenly at room temperature to obtain the carboxyl-containing polyimide modified epoxy adhesive. Its use effect can reach the purpose of the invention.

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Abstract

The invention relates to a high-temperature-resistant modified epoxy resin adhesive and a preparation method thereof. The high-temperature-resistant modified epoxy resin adhesive comprises the following formula components by weight percent: 55%-58% of epoxy resin, 1%-6% of carboxyl-containing polyimide powder, 3.8%-4% of curing agent, 28.7%-30.5% of diluent and 6.3%-6.8% of terminal carboxyl nitrile rubber. The formula components are mixed evenly to obtain the adhesive. According to the preparation method, carboxyl-containing polyimide is added in an epoxy resin substrate, thereby effectivelyimproving the strength of the adhesive and reducing the brittleness of the cured material of the adhesive; the preparation method has the advantages of simple process and low cost, and is convenient for operation; and the preparation method has a high practicable value for the development of the adhesive industry and has a wide application prospect in multiple fields, such as electronics, microelectronics and the like.

Description

technical field [0001] The invention belongs to the technical field of epoxy resin adhesives, in particular to a high-temperature-resistant modified epoxy resin adhesive and a preparation method thereof. Background technique [0002] Epoxy resin is an adhesive with good bonding performance, high bonding strength and wide bonding surface. It can be used with many metals (such as iron, steel, copper, aluminum, metal alloys, etc.) or non-metallic materials (such as Glass, ceramics, wood, plastic, etc.), and the bonding strength is very high, even exceeding the strength of the bonded material itself. In addition, it also has good processability and good stability. However, due to its low elongation, high brittleness, and poor fatigue resistance of the bonding parts, it is not suitable for use in structural parts. The brittleness of cured epoxy resin greatly limits its application. Therefore, improving the performance of epoxy resin adhesives has become one of the hotspots of s...

Claims

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Application Information

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IPC IPC(8): C09J163/00C09J179/08C09J113/00C08G73/10
Inventor 虞鑫海李恩徐亚新樊良子吴爽徐永芬
Owner DONGHUA UNIV
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