Plastic with high thermal conductivity and preparation method thereof

Abstract

The invention provides a plastic with high thermal conductivity, and the plastic is prepared from the following components in parts by weight: 100 parts of base resin, 1-60 parts of organic fibers, 5-50 parts of large-particle-size heat-conducting filler, 10-100 parts of small-particle-size heat-conducting filler and 0-2 parts of antioxidant. The preparation method of the plastic with high thermal conductivity is performed by adopting a two-step granulation method. In the invention, the thermal conduction performance of the entire system is improved by selecting crystalline resin base body and improving the thermal conductivity of the crystalline resin base body, and at the same time, less filler filling and higher thermal conductivity are achieved by filling with the inorganic filler of which the thermal conductivity is 10-1000 times higher than that of the base resin and selecting proper particle size matching.

Description

technical field [0001] The invention relates to chemical products, in particular to a high thermal conductivity plastic and a preparation method thereof. Background technique [0002] Due to its excellent thermal conductivity, metals are widely used in heat dissipation, such as chemical engineering, wastewater treatment, solar heat exchange, battery cooling, heat dissipation of integrated circuit boards, automobiles, automation equipment and various industrial cooling equipment. Metal heat exchangers, however, metal heat exchangers also have many problems, such as high metal density, resulting in heavy equipment weight; metals are not corrosion-resistant, and subsequent electroplating processes for anti-corrosion cause environmental pollution and so on. High thermal conductivity plastics can overcome the above-mentioned shortcomings of metals, and at the same time have lower costs and product design freedom (can be injection molded). [0003] In order to obtain plastics wit...

AI Technical Summary

Problems solved by technology

The addition of fillers in the resin matrix is ​​due to the very low thermal conductivity of the matrix resin, which leads to low thermal conductivity and cannot fully exert its thermal conductivity. It is necessary to add a sufficient amount to form a filler thermal network to improve the thermal conductivity of the product. It will greatly increase the cost of materials and reduce the flow processing performance of materials