Alkaline chloride copper-plating treatment agent and preparation method thereof
A treatment agent and chloride technology, applied in the field of alkaline chloride copper plating treatment agent and its preparation, can solve the problems of high concentration of plating solution, uneven thickness of plating layer and high cost, and achieve high bonding rate of plating layer and fast deposition speed. , The effect of strong impurity resistance
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[0025] The present embodiment optimizes and prepares copper plating treatment agent by weight percentage, and it comprises following composition:
[0026] Sodium Hydroxide 7%
[0027] Potassium chloride 6%
[0028] Copper Sulfate 3%
[0029] 1.4 Butynediol 0.4%
[0030] Sodium Potassium Tartrate 4%
[0031] Water 79.6%
[0032] Its preparation method is as follows: add part of water into the electrolytic tank, pour sodium hydroxide into the tank and stir until it is completely dissolved, and prepare a sodium hydroxide solution with a concentration of 30%; dissolve copper sulfate in water at 70°C, and stir until completely dissolved After dissolving, add potassium chloride or sodium chloride, stir until completely dissolved, then add to the above sodium hydroxide solution; add potassium sodium tartrate to the above mixed solution, stir until completely dissolved, cool to below 40°C; finally add 1.4 Butynediol, stir evenly to be electroplated, electrolyze for 2.5 hours at a...
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