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High-strength high-heat-resistance copper alloy

A high heat resistance, copper alloy technology, applied in the direction of electrical components, circuits, electric solid devices, etc., can solve the problems of reduced heat resistance, difficulty in obtaining, high strength, etc., and achieves improved smoothness, strength and heat resistance. , the effect of improving hot workability

Inactive Publication Date: 2011-09-21
KOBE STEEL LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0008] However, although the Cu-Ni-Fe-P-based copper alloy sheet disclosed in Patent Document 1 achieves its desired purpose, the tensile strength is only about 700 MPa, and it is difficult to obtain higher strength, and it is difficult to cope with The problem of further thinning the lead frame compared with the conventional one
In addition, this conventional Cu-Ni-Fe-P-based copper alloy sheet is finished-rolled (finally cold-rolled) at a high working rate, so although it is possible to increase the strength, such forced high-strength increases the resistance to corrosion. heat reduction, and is not practical

Method used

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Embodiment 1

[0083] Next, experimental results of Examples and Comparative Examples capable of demonstrating the effects of the present invention will be described. As a method of manufacturing a copper alloy plate, after melting a copper alloy melt having the composition shown in Table 1 below in a high-frequency furnace, it is poured into a graphite-made book (book) mold to obtain a thickness of 50 mm and a width of 50 mm. 200mm ingot with a length of 200mm. After the ingot is solidified in the mold, it is water-cooled from a temperature of 700 to 800°C. In addition, the casting mold made of graphite has sufficient heat capacity and thermal conductivity, and the cooling rate at the time of solidification obtained from the secondary branch interval between dendrite arms is 1° C. / sec or more. In addition, the copper alloys shown in Table 1 contain elements such as Si, Ti, Zr, Be, V, Nb, Mo, W, and Mg in a total amount of 0.01% by mass or less as unavoidable impurities. Contains elements ...

Embodiment 2

[0114] Next, the experimental results of the relationship between the surface properties and the oxide film adhesion maintenance temperature will be described. In this Example 2, a copper alloy plate having a thickness of 0.2 mm was obtained from the ingot of Example 2 in Table 1 by the same method and conditions as in Example 1. Therefore, the characteristics of composition, composition ratio, base metal structure, tensile strength, general elongation, hardness, electrical conductivity, heat resistance, and etchability are the same as those of Example 2 in Table 3.

[0115] However, the annealing is twice annealing and low temperature annealing, and, in N 2 +10%H 2 atmosphere (dew point: below -20°C, O 2 Concentration: 50ppm or less), changing the cleaning treatment before and after annealing, thereby changing the surface properties (relative C content, area ratio of fine crystal grains) of the copper alloy sheet, and evaluating the oxide film adhesion maintenance temperatu...

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Abstract

The present invention provides a high-strength high-heat-resistance copper alloy which has the following advantages: high tensile strength which is above 750MPa, high strength which is above Hv220, high heat resistance, and excellent jointing performance with an oxide film. The high-strength high-heat-resistance copper alloy comprises the following components in total weight: 0.4-1.0% of Ni;0.03-0.3% of Fe and / or Co (called M below); 0.05-0.2% of P; 0.1-3% of Sn; 0.05-2.5% of Zn; and 0.0005-0.05% of Cr; wherein a ratio (Ni+M) / P is 4-12; Ni / M is 3-12; the number of fine phosphide precipitationparticles with grain diameters in 1-20 nm is above 300 / mu m<2>; the number of coarse crystal precipitation particles with grain diameters which exceed 100 nm is less than 0.5 / mu m<2>; and Sn / (Ni+M+P+Sn) is above 0.01.

Description

technical field [0001] The present invention relates to an oxide film suitable for use as a material for a lead frame for a semiconductor device such as a material for an electrical and electronic component, particularly a lead frame material for a QFP (Quad Flat Package) package or a QFN (Quad Flat no Lead Package) package. High-strength, high-heat-resistant copper alloy material with excellent film adhesion. Background technique [0002] Conventionally, copper alloy sheets made of Cu—Ni—Si-based copper alloys containing Ni and Si have been often used as high-strength lead frame materials. In addition, among the Cu-Ni-Si copper alloys, for example, a copper alloy (C70250 copper alloy) containing Ni: 2.2 to 4.2% by mass, Si: 0.25 to 1.2% by mass, and Mg: 0.05 to 0.30% by mass (C70250 copper alloy) is It has excellent thermal properties, so it is widely used as a general-purpose alloy. [0003] Recently, with the increase in capacity, miniaturization, and high functionality...

Claims

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Application Information

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IPC IPC(8): C22C9/02C22C9/04
CPCC22C9/02H01L2924/0002H01L2924/00C22C9/00H01L23/50
Inventor 尾崎良一
Owner KOBE STEEL LTD
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