Silicon crystal line cutting equipment

Abstract

The invention provides silicon crystal multi-line cutting equipment for line cutting operation of a crystal silicon ingot to be cut. The equipment comprises a liquid accommodating tank for soaking the crystal silicon ingot to be cut into cutting solution, and a multi-line cutting device for forming a cutting net; the falling cutting net presses the liquid accommodating tank and the crystal silicon ingot to be cut in the cutting solution, so that the cutting lines cut the crystal silicon ingot to be cut in the cutting solution at the same time of cutting the side plates of the liquid accommodating tank; and in the cutting process, the cutting solution flows out from the breaches of the side plates of the cut liquid accommodating tank so as to facilitate reclamation. The equipment solves the problem that sparse cutting solution is brought to the cutting area in the cutting process, so that the cutting efficiency is greatly improved, and the problems of low capacity and the like because the cutting lines, the workpiece and the cutting solution are not fully contacted are solved.

Description

technical field [0001] The invention relates to a wire cutting technology, in particular to a silicon crystal multi-wire cutting device for improving the utilization rate of cutting fluid and reducing production costs. Background technique [0002] Multi-wire cutting technology is a relatively advanced crystalline silicon processing technology in the world at present. Its principle is to use a high-speed moving steel wire to drive the cutting blade attached to the steel wire to rub against hard and brittle materials such as semiconductors to achieve the cutting effect. Compared with the traditional saw blade, grinding wheel and inner circle cutting, the multi-wire cutting technology has the advantages of high efficiency, high productivity and high precision. The multi-wire cutting technology is currently the most widely used cutting technology for hard and brittle materials such as semiconductors. [0003] Existing multi-wire cutting equipment such as crystalline silicon ing...

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Problems solved by technology

[0006] In view of the above-mentioned shortcoming of prior art, the object of the present invention is to provide a kind of silicon crystal multi-wire cutting equipment, be used for solving the problem that cutting liquid is brought into the cutting area rare in cutting process, and cutting wire, workpiece and cutting Problems such as low production capacity due to insufficient contact with liquid

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