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Heat-resistant and highly heat-conductive adhesive agent

A high thermal conductivity, adhesive technology, applied in the direction of adhesives, non-polymer adhesive additives, adhesive types, etc., can solve the problems of adhesive aging over time, achieve stable heat resistance, excellent mechanical intensity effect

Inactive Publication Date: 2011-08-31
岛根县
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

This phenomenon may cause aging of the adhesive

Method used

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  • Heat-resistant and highly heat-conductive adhesive agent
  • Heat-resistant and highly heat-conductive adhesive agent
  • Heat-resistant and highly heat-conductive adhesive agent

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0061]To a mixture of concentrated sulfuric acid and concentrated nitric acid (3:1 by volume), multi-walled carbon nanotubes (MWNT, manufactured by Tsinghua-Nafine-Powder Commercialization Engineering Center, inner diameter: 2-30 nm, outer diameter: 5-60 nm) were added to form Suspended mixture. The concentration of MWNTs in the suspension mixture was made 0.5 mg / mL. The resulting suspension mixture was sonicated for 1 hour and mechanically stirred at 20 rpm for 1.5 hours. Next, the mixture was heated to 80°C and refluxed for 1 hour. After cooling to room temperature, the mixture was diluted with distilled water, filtered under reduced pressure using a microfiltration membrane, and washed with distilled water to remove the acid.

[0062] Distilled water was added to the solid matter on the microfiltration membrane and centrifuged for 15 minutes to separate the precipitated solid matter and the upper suspension. The solid matter is centrifuged under the same conditions to se...

Embodiment 2

[0070] Carbon nanofibers (CF, manufactured by Shen yang Gian Advanced materials Co., Ltd., 200-500 nm in outer diameter, 40 μm in length) were added to a mixture of concentrated sulfuric acid and concentrated nitric acid (volume ratio 3:1) to form a suspension mixture. The concentration of CF in the suspension mixture was made 0.5 mg / mL. The resulting suspension mixture was sonicated for 1 hour and mechanically stirred at 20 rpm for 1.5 hours. Next, the mixture was heated to 80°C and refluxed for 1 hour. After cooling to room temperature, the mixture was diluted with distilled water, filtered under reduced pressure using a microfiltration membrane, and washed with distilled water to remove the acid.

[0071] Distilled water was added to the solid matter on the microfiltration membrane and centrifuged for 15 minutes to separate the precipitated solid matter and the upper suspension. The solid matter is centrifuged under the same conditions to separate the solid matter and the...

Embodiment 3

[0080] In addition to EP-MWNT, CF-COOH, MWNT-NH 2 Except that the mixing ratio with nitrile rubber was changed to 500:200:150:150, the procedure of Example 2 was repeated to obtain an adhesive.

[0081] The obtained adhesive exhibited a tensile strength of 14 MPa and a heat resistance of 260°C. The curing conditions used were heating at 80°C for 1 hour followed by heating at 160°C for 2 hours. In addition, the cured adhesive showed a thermal conductivity of 1.54 W / m·K.

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Abstract

Provided is a heat-resistant and highly heat-conductive adhesive agent which has excellent mechanical strength, heat-resistance and heat-conductivity. A heat-resistant and highly heat-conductive adhesive agent comprising (a) a first component wherein a carbon-based filler having been surface-modified with a first reactive functional group and an adhesive polymer matrix having a second reactive functional group are bonded to each other by an addition condensation reaction between the first reactive functional group and the second reactive functional group, and (b) a second component which comprises a carbon-based filler having been surface-modified with a third reactive functional group, wherein the third reactive functional group is a functional group which undergoes an addition condensation reaction with the second reactive functional group by the application of light or heat.

Description

technical field [0001] The present invention relates to a highly thermally conductive adhesive, and more specifically, to a highly thermally conductive adhesive having heat resistance. Background technique [0002] The high thermal conductivity adhesive with heat resistance is a new type of adhesive with both physical properties of high heat resistance and high thermal conductivity. There is no clear standard specifying the heat resistance of adhesives. In this regard, NASA sets the standard for heat-resistant adhesives as follows. [0003] (1) Continuous action for thousands of hours at -232°C; and [0004] (2) (a) at 316°C for hundreds of hours, or (b) at 538°C for several minutes. [0005] Aromatic polymers and heterocyclic polymers are widely used as materials for heat-resistant adhesives. This is because these materials have a rigid structure, a molecular chain including a conjugated system, and a molecule having a high concentration, and can exhibit excellent physi...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J201/02C09J9/00C09J11/04
CPCC09J11/04C08K3/04C09J9/00C08K7/24C08K9/04C08K7/06C09J163/00C08L9/02C08K3/041C08K3/046C09J201/02
Inventor 吉野胜美佐藤公纪上野敏之吉冈尚志封伟
Owner 岛根县
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