High-power loop heat pipe radiator and manufacturing method thereof

Abstract

The invention relates to a high-power loop heat pipe radiator and a manufacturing method thereof. The radiator comprises a plate evaporator, a condenser, at least a steam line and at least a liquid line, wherein the steam line and the liquid line are used for connecting the plate evaporator with the condenser; the liquid line is also communicated with a vacuumizing and working medium filling line; a porous material is fixed inside the plate evaporator; and a plurality of communicated steam discharge channels are formed in the porous material. The manufacturing method comprises the following steps: preparing the porous material; stamping a top cover and a bottom plate of the plate evaporator; putting the porous material between the top cover and the bottom plate and fixedly connecting the top cover with the bottom plate; carrying out welding and communicating; and carrying out cleaning, vacuumizing, working medium filling and sealing. The radiator and the manufacturing method have the following advantages that: the radiation and installation use requirements of the high-power power electronic devices can be well met, the aim of full and effective contact with the power electronic devices can be achieved and the special evaporator structure further saves the space and is further beneficial to reinforcement of heat exchange, thus farthest reducing the radiating heat resistance.

Description

technical field [0001] The invention relates to a heat dissipation device in the field of power electronic products, in particular to a high-power loop heat pipe radiator and a manufacturing method thereof. Background technique [0002] Power electronics plays an important role in AC and DC motors, transportation, power systems, and power systems. At present, power electronic control technology has developed to the stage where IGBT and power integrated devices are the main technical means. IGBT (Insulated Gate Bipolar Transistor), that is, insulated gate bipolar transistor, is a composite fully-controlled voltage-driven power semiconductor device composed of a bipolar transistor and an insulated gate field effect transistor, with high input impedance and low conductance. Advantages in terms of pressure drop. It is very suitable for the conversion system with a DC voltage of 600V and above, such as AC motors, frequency converters, switching power supplies, lighting circuits...

AI Technical Summary

Problems solved by technology

They can solve the heat dissipation problem of high-power devices to a certain extent, but there are the following disadvantages: (1) fan + heat sink, in order to enhance the heat dissipation capacity of the heat dissipation device, only by increasing the area of ​​heat dissipation fins and increasing the fan speed, resulting in The result is that the noise is large, the heat sink is large and heavy, which is not conducive to installation and will generate a lot of pressure on electronic devices; (2) fan + heat pipe + radiator can solve the shortcomings in method 1, but it will increase the mechanism itself. The complexity, design and installation of heat pipes are often limited by the actual structure, and under the action of limited heat pipes, its heat dissipation capacity is still limited; 3) Liquid cooling technology, which surpasses the above two methods in performance, and liquid cooling heat dissipation technology The potential of liquid cooling technology is very high, but liquid cooling technology has defects such as extremely complicated mechanism, easy oxidation during long-term operation, the need to add a pump to drive the circulation of liquid working medium, and currently there is no way to completely ensure that the pipeline connection does not leak, etc., which will affect the liquid cooling technology. The actual service life of the cooling device, and the cost of the liquid cooling device is the highest, and the cost of the same cooling capacity is more than 3 times that of the ordinary heat pipe radiator

Finally, due to the heat dissipation of high-power IGBT power modules, several kilowatts of heat are generated on an area of ​​about tens of square centimeters, and the heat flux density is very high. However, the existing loop heat pipe heat dissipation structure has not been able to deeply explore such technologies heat dissipation potential

[0008] This shows that the above-mentioned existing high-power power electronic device cooling device obviously still has inconvenience and defects in structure and use, and needs to be further improved urgently.

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