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Manufacturing method of cured film, photosensitive resin composition, cured film, organic EL display device and liquid crystal display device

A technology of photosensitive resin and manufacturing method, which is applied in the field of photosensitive resin composition and manufacturing method of cured film, can solve problems such as insufficient sensitivity, and achieve the effect of excellent heat resistance and transparency

Active Publication Date: 2011-08-03
FUJIFILM CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, in the case of this composition, the sensitivity is insufficient

Method used

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  • Manufacturing method of cured film, photosensitive resin composition, cured film, organic EL display device and liquid crystal display device
  • Manufacturing method of cured film, photosensitive resin composition, cured film, organic EL display device and liquid crystal display device
  • Manufacturing method of cured film, photosensitive resin composition, cured film, organic EL display device and liquid crystal display device

Examples

Experimental program
Comparison scheme
Effect test

preparation example Construction

[0338] (Method for preparing photosensitive resin composition)

[0339] The essential components of Component A to Component C and optional components added as needed are mixed in a predetermined ratio by any method, stirred and dissolved, and a photosensitive resin composition is prepared. For example, after dissolving component A or component B in a solvent in advance to prepare a solution, respectively, these may be mixed at a predetermined ratio to prepare a photosensitive resin composition. The photosensitive resin composition prepared above can also be used after filtering using the filter etc. which have a pore diameter of 0.2 micrometers.

[0340] II. Manufacturing method of cured film

[0341] The method for producing a cured film of the present invention is characterized in that it includes the following steps in the following order: (1) a low-temperature treatment step of bringing the temperature of the photosensitive resin composition to 10° C. or lower; (2) combini...

Embodiment 1～44、 comparative example 1～7、 Embodiment 101～139

[0407] (Examples 1-44, Comparative Examples 1-7, Examples 101-139, Examples 201-239 and Examples 301-308)

[0408] Mix the ingredients shown in Table 2 to Table 5, and then add a 1:1 mixed solvent of C1: propylene glycol monomethyl ether acetate and C2: diethylene glycol ethyl methyl ether to make the viscosity 3.0 mPa·s , and filtered through a 0.2 μm polytetrafluoroethylene filter to prepare a positive-type photosensitive resin composition.

[0409] Table 2

[0410]

[0411] table 3

[0412]

[0413] Table 4

[0414]

[0415] table 5

[0416]

[0417] In addition, the abbreviations in Table 2 to Table 5 are as follows.

[0418]

[0419] B5: α-(4-tosyloxyimino)benzonitrile (synthesized according to the method described in paragraph 0108 of JP 2002-528451 A.)

[0420] B6: α-[(4-tosyloxyimino)-4-methoxyphenyl]acetonitrile (PAI-101, manufactured by Midori Chemical Co., Ltd.)

[0421] D1: NBCA (10-butyl-2-chloroacridone, manufactured by Kurokane Kasei Co., Ltd....

Embodiment 1

[0456] The following evaluation was performed using the photosensitive resin composition of Example 1.

[0457]

[0458] The prepared photosensitive resin composition was temporarily treated at low temperature under the conditions shown in Table 6, and then returned to room temperature (23° C.). After slit-coating the photosensitive resin composition on a glass substrate of 2160×2460 mm, the solvent was removed by prebaking on a hot plate at 90° C. for 90 seconds, and a coating film having a film thickness of 3 μm was formed. Next, exposure was performed through a predetermined mask using FX-85S (i-line method, manufactured by Nikon Corporation). After exposure, at the temperature shown in Table 6, after only passing the time shown in Table 6, use 0.4% by weight of tetramethylammonium hydroxide aqueous solution at 25 ° C for 35 seconds after spray development, then shower with ultrapure water Wash for 1 minute. Through these operations, the optimum exposure amount (E opt ...

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Abstract

The present invention provides a manufacturing method of a cured film which can be manufactured with a high and stable sensitivity, has contact holes manufactured by slit coating, and has excellent pattern formation performance, ITO sputtering tolerance and heat-resistant transparency. The manufacturing method of the cured film includes the following procedures: a procedure for allowing the temperature of a photosensitive resin composition to be below 10 DEG C; a procedure for coating the photosensitive resin composition onto a substrate by slit coating; a procedure for removing solvents from the coated photosensitive resin composition; a procedure for exposing the photosensitive resin composition with removed solvents by active light ray; a procedure for standing for more than 45 seconds at room temperature; a procedure for performing development by a water developer; and a procedure for performing thermal curing. The photosensitive resin composition comprises the following components: (component A) a copolymer containing a structure unit with residues formed by protecting acyloxy groups by acid decomposing groups, a structure unit with crosslinking groups, and a structure unit with carboxyl and / or phenolic hydroxyl; (component B) a photoacid generator; and (component C) a solvent.

Description

technical field [0001] The present invention relates to a method for producing a cured film, a photosensitive resin composition, a cured film, an organic EL (organic electro) display device, and a liquid crystal display device. Background technique [0002] In the past, in electronic components such as liquid crystal display elements, integrated circuit elements, solid-state imaging elements, and organic EL, it is generally used to form a planarizing film for imparting flatness to the surface of the electronic component, and to protect the electronic component from deterioration or damage. The photosensitive resin composition is used for a film or an interlayer insulating film that maintains insulation. In recent years, along with the increase in size of display devices, there is a demand for slit coater suitability for coating and manufacturing with a slit coater. In addition, with this increase in size, exposure becomes time-consuming, and high sensitivity is required in ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G03F7/00G03F7/039H01L27/32G02F1/1333G03F7/004H10K99/00
CPCG02F1/13G02F1/1303G03F7/00G03F7/004G03F7/0045H10K71/00H10K99/00
Inventor 安藤豪杉原幸一
Owner FUJIFILM CORP
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