Housing of electronic device and manufacturing method thereof
A technology for electronic devices and manufacturing methods, which is applied to metal casings, electrical equipment casings/cabinets/drawers, electrical components, etc., and can solve the problems of insufficient material hardness, single color, and no longer beautiful and eye-catching appearance.
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[0018] see figure 1 , the electronic device housing 10 according to the first embodiment of the present invention includes a metal base 12 and a ceramic coating 14 .
[0019] The metal base 12 can be made of stainless steel, aluminum alloy, etc., and its thickness is about 0.4-0.6 mm, and in this embodiment it is 0.5 mm. The metal base 12 includes a first surface 122 and a second surface 124 opposite to the first surface 122 . The first surface 122 is a rough surface with a roughness Ra of about 1.3-2.0 μm. The ceramic coating 14 is directly formed on the first surface 122 and covers the entire first surface 122 . The ceramic coating 14 is made of aluminum oxide (Al 2 o 3 ), ferric oxide (Fe 3 o 4 ), titanium oxide (TiO 2 ) and other oxide ceramic materials, its thickness is about 0.12~0.14mm, and its surface roughness is 0.1~0.3μm. Because the above-mentioned ceramic materials have their own color, the ceramic materials can be selected according to the needs of the co...
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