Double-sided printed circuit board (PCB) with elements and mutual conductance method thereof

Abstract

The invention discloses a double-sided printed circuit board (PCB) with elements and a mutual conductance method thereof, and provides a method for realizing mutual conductance by elements used in a double-sided PCB. The method comprises the following steps: providing the double-sided PCB with holes, wherein, the PCB comprises a top circuit layer, a bottom circuit layer and an insulating film layer bonded between the top circuit layer and the bottom circuit layer, and the holes pass through the top circuit layer and the insulating film layer besides the bottom circuit layer; optionally forming the bottom circuit layer at the holes to be aligned with or approximately aligned with the top circuit layer; and welding one part of the elements on the top circuit layer, and welding the other part of the elements on the bottom circuit layer at the holes so as to realize mutual conductance of the two circuit layers. The mutual conductance method is simple and low in cost; and double-sided circuits are conducted without eletcroless copper plating during the manufacturing process, thus being very environmental-friendly. The invention further discloses the PCB with the elements manufactured by the method.

Description

technical field [0001] The present invention relates to the field of printed circuit boards, in particular to a new method of interconnection and conduction such as double-sided flexible circuit boards (FPC) or rigid circuit boards, for example, directly soldering the component pins on the other side of the circuit through SMT reflow to make the double-sided The circuit on both sides of the circuit board is conductive. The invention also discloses the non-chemical method of forming the via hole without drilling and copper plating, and this method is more convenient for making continuous rolls of double-sided light strip circuit boards. Background technique [0002] In the traditional double-sided circuit board manufacturing process, mechanical drilling or laser drilling is generally used to drill circuit via holes on the copper clad laminate, and then the chemical copper plating process is used to make the double-sided flexible printed circuit board The inner wall of the th...

AI Technical Summary

Problems solved by technology

This method causes serious pollution to the environment due to the need for electroplating and electroless plating

[0003] However, the traditional carbon oil filling hole or silver paste filling hole is usually used to form conduction on both sides of the double-sided printed circuit without copper plating, which has its obvious disadvantages. The cost of carbon oil filling is low, but due to carbon Oil has high resistance and poor conductivity; while silver paste has good conductivity, but the price of silver paste is very expensive and not suitable for mass production.

[0004] At the same time, the mechanical drilling machine and laser drilling machine in the traditional production process are expensive, the drilling speed is slow, and the production efficiency is low

And because the mechanical drilling machine is a plane drilling, its table is about 635×762mm, so the largest board that can be produced is about 635×762mm, and it cannot produce boards larger than 762mm. With the continuous development of the LED industry today, LED lights There is an increasingly urgent need for ultra-long circuit boards larger than 762mm, even reaching a length of more than 100 meters, so the traditional drilling method to make via holes is increasingly unable to meet the needs of technological development

Moreover, a large amount of phenolic tree branch cover board and wood fiber bottom board will be consumed during mechanical drilling. After the laser drilling machine is burned at high temperature, the insulating polymer resin of the printed circuit board will be vaporized and discharged into the air, which is not conducive to environmental protection.

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