Micro electro mechanical system (MEMS) gyroscope, chip level temperature control method thereof and processing method thereof

Abstract

The invention relates to a micro electro mechanical system (MEMS) gyroscope, a chip level temperature control method thereof and a processing method thereof. A microheater and a temperature sensor are processed on a glass substrate by a micromachining technique; the glass substrate is bonded with an MEMS gyroscope structure chip; the MEMS gyroscope chip is heated by applying voltage at the two ends of the microheater; and the integrated temperature sensor monitors the temperature of the MEMS gyroscope chip in real time so as to drive a peripheral circuit to adjust the voltage at the two ends of the heater and keep the temperature of the gyroscope chip constant and a little higher than the upper limit of the temperature of the working environment. The heater and the temperature sensor are integrated on the glass substrate, the volume is small and the temperature sensitivity is high. The chip level temperature control method has the characteristics of low power consumption, small volume, high applicability and high repeatability, can be compatible with the micromachining process, can realize batch production, and can be widely applied to chip level temperature control of other MEMS chips.

Description

technical field [0001] The invention belongs to the field of micro-electromechanical systems (MEMS), and in particular relates to a MEMS gyroscope and a chip-level temperature control method and processing method thereof. Background technique [0002] A MEMS gyroscope is a typical inertial sensor that measures the angular velocity of an object's rotation. With the continuous improvement of the accuracy of MEMS gyroscopes, the error caused by temperature changes has become one of the main errors of MEMS gyroscopes. Because changes in temperature will cause changes in the material properties, size, and quality factor of the MEMS gyroscope, these changes will cause a sharp decline in the performance of the MEMS gyroscope. Therefore, correcting the temperature error of the MEMS gyroscope is very important for improving the performance of the MEMS gyroscope. [0003] There are many compensation and correction methods for MEMS gyroscope temperature error, and there are three com...

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Problems solved by technology

In 2003, Cenk Acar and Andrei M.Shkel of the Microsystems Laboratory of the University of California in the United States proposed a distributed mass silicon microgyroscope. This structure distributes multiple driving modes at a certain frequency interval, increasing the bandwidth of the driving mode. , thus greatly reducing the sensitivity of the mechanical gain of the micro gyroscope to the frequency difference between the two modes, that is, enhancing the anti-interference ability of the mechanical gain to temperature, but its structure and process are complicated, the cost is high, and the structural improvement requires a clear temperature The model or mechanism of the error, so the actual design structure can only eliminate one or several known temperature errors

Temperature control technology is a common way to improve the temperature drift in the output signal of traditional mechanical gyroscopes. Conventional temperature control generally takes the entire gyroscope as the temperature control object, with slow heating speed, large power consumption, and large inertia. At the same time, the temperature measured by the temperature sensor It is the temperature of the monitoring points around the gyroscope or the temperature of a certain part of the gyroscope, which cannot fully and truly reflect the temperature characteristics of the entire gyroscope structure, so the temperature control accuracy is limited, the temperature uniformity is poor, and the general temperature control devices are not compatible with the MEMS process. Conducive to miniaturization and integration of micro gyro

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