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Preparation method of Al-Si-Ti ternary active solder for aluminum-based composite material

An aluminum-based composite material, al-si-ti technology, applied in the direction of welding/cutting media/materials, manufacturing tools, welding equipment, etc., can solve problems such as poor wettability, achieve dense interface, short welding time, adaptable surface wide effect

Inactive Publication Date: 2013-04-17
XI AN JIAOTONG UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0022] The purpose of the present invention is to overcome the disadvantages of the poor wettability of the existing brazing filler metal for ceramics to the ceramic reinforcement phase, and therefore have to be supplemented with other relatively complicated auxiliary techniques (such as scraping, vibration, gaskets), by improving the brazing filler metal Metallurgical design approach, providing an Al-Si-Ti system ternary active solder for aluminum matrix composite materials and its preparation method, so that the solder can improve the interface between ceramic reinforcement phase particles (or short fibers) and liquid metal solder (collectively referred to as is the wettability between the R / M interface)

Method used

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  • Preparation method of Al-Si-Ti ternary active solder for aluminum-based composite material
  • Preparation method of Al-Si-Ti ternary active solder for aluminum-based composite material
  • Preparation method of Al-Si-Ti ternary active solder for aluminum-based composite material

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Experimental program
Comparison scheme
Effect test

Embodiment 1

[0050] In this embodiment, the preparation method of Al-Si-Ti series ternary active solder for aluminum-based composite materials comprises the following steps:

[0051] 1) material selection

[0052] The selected raw materials are: pure Al, Al-20Si master alloy and Al-5Ti master alloy;

[0053] 2) Ingredients

[0054] Al-5Ti master alloy, Al-20Si master alloy and pure aluminum ingot are mixed so that the mass percentage of Si in the mixture is 7%, the mass percentage of Ti is 1.2%, and the balance is Al; and the mixture is placed in the crucible;

[0055] 3) Smelting

[0056] First pass high-purity Ar into the crucible, and discharge the air in it; then, under the protection of Ar, use high-frequency induction heating to heat up to the melting temperature of 850 ° C, and keep it for 30 minutes; then, continue to stand and cool and solidify under the protection of Ar. condensation block;

[0057] 4) Strip forming

[0058] After the condensed block is remelted, it is made...

Embodiment 2

[0060] In this embodiment, the preparation method of Al-Si-Ti series ternary active solder for aluminum-based composite materials comprises the following steps:

[0061] 1) material selection

[0062] The selected raw materials are: pure Al, Al-20Si master alloy and Al-5Ti master alloy;

[0063] 2) Ingredients

[0064] Al-5Ti master alloy, Al-20Si master alloy and pure aluminum ingot are mixed so that the mass percentage of Si in the mixture is 14%, the mass percentage of Ti is 0.1%, and the balance is Al; and the mixture is placed in the crucible;

[0065] 3) Smelting

[0066] First pass high-purity Ar into the crucible, and discharge the air in it; then, under the protection of Ar, use high-frequency induction heating to heat up to the melting temperature of 850 ° C, and keep it for 30 minutes; then, continue to stand and cool and solidify under the protection of Ar. condensation block;

[0067] 4) Strip forming

[0068] After the condensed block is remelted, it is mad...

Embodiment 3

[0070] In this embodiment, the preparation method of Al-Si-Ti series ternary active solder for aluminum-based composite materials comprises the following steps:

[0071] 1) material selection

[0072] The selected raw materials are: pure Al, Al-20Si master alloy and Al-5Ti master alloy;

[0073] 2) Ingredients

[0074] Al-5Ti master alloy, Al-20Si master alloy and pure aluminum ingot are mixed so that the mass percentage of Si in the mixture is 12%, the mass percentage of Ti is 1%, and the balance is Al; and the mixture is placed in the crucible;

[0075] 3) Smelting

[0076] First pass high-purity Ar into the crucible, and discharge the air in it; then, under the protection of Ar, use high-frequency induction heating to heat up to the melting temperature of 750 ° C, and keep it for 30 minutes; then, continue to stand and cool and solidify under the protection of Ar. condensation block;

[0077] 4) Strip forming

[0078] After the condensed block is remelted, it is made ...

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Abstract

The invention discloses an Al-Si-Ti ternary active solder for an aluminum-based composite material and a preparation method thereof. The solder comprises the following components in percentage by mass: 7 to 14 percent of Si, 0.1 to 1.2 percent of Ti and the balance of Al. During soldering, the solder is appropriately pressurized after being preset and is heated to about 610 DEG C. Compared with the conventional Al-Si eutectic solder, the Al-Si-Ti ternary active solder has the advantages that: (1) a ceramic reinforced phase micro zone can be well wetted through reaction between a liquid activeelement Ti and a ceramic reinforced phase, so that a residual air gap between the ceramic reinforced phase and the solder is eliminated; (2) an aluminum matrix micro zone is free from a soldering flux and cleaning after soldering, wherein the solder breaks an oxidation film through a metallurgical reaction path, namely through reaction between the active element Ti and the oxidation film on the surface of an aluminum matrix, so that an interfacial air gap is eliminated in advance, and a diffusion channel is quickly established to make wetting and Si penetration performed in advance; (3) the solder has a compact interface and short required soldering time; (4) ceramic particle segregation is avoided; and (5) the solder has high applicability, is particularly suitable for the aluminum-basedcomposite material taking aluminum oxide as a reinforcing phase and the aluminum-based composite material with high volume fraction.

Description

technical field [0001] The invention belongs to the technical field of material preparation, and relates to a solder, in particular to an Al-Si-Ti ternary active solder for aluminum-based composite materials and a preparation method thereof. Background technique [0002] Compared with metal aluminum materials, the ceramic reinforcement phase of aluminum matrix composites (Al MMCs: aluminum metal matrix composites) endows aluminum matrix composites with many superior properties (such as high specific strength, high specific stiffness, strong heat resistance, Strong wear resistance, small thermal expansion coefficient, etc.), but the existence of ceramic reinforcement phase seriously deteriorates the weldability of aluminum matrix composites, which poses new challenges to commonly used welding techniques or welding materials. [0003] First of all, aluminum matrix composites are difficult to be welded by fusion welding (including arc welding, laser welding, electron beam weldi...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B23K35/28
Inventor 张贵锋苏伟张建勋
Owner XI AN JIAOTONG UNIV
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