Epoxy resin dough moulding compound and preparation method thereof

Abstract

The invention discloses an epoxy resin dough moulding compound and a preparation method thereof. The epoxy resin dough moulding compound is prepared by evenly kneading 35-40 parts by mass of epoxy resin paste, 4-5 parts by mass of curing agent mixture and 65-70 parts by mass of chopped fiber, wherein the epoxy resin paste comprises the following components in parts by mass: 80-120 parts of epoxy resin, 5-10 parts of plasticizer, 4-8 parts of filler, 3-6 parts of mould release agent and 0.5-2 part(s) of coupling agent; the curing agent mixture comprises the following components in parts by mass: 4-7 parts of latent curing agent, 1-3 part(s) of accelerator and 6-10 parts of amine curing agent, and the length of the chopper fiber is one eighth to one half inch. Compared with the traditional method, the preparation method eliminates the curing process, and the dough moulding compound is prepared by adding modifying components and different curing systems into the epoxy resin. The method has the advantages of simple operation, high production efficiency, long working life and easy formation. Since the baking oven and other heating equipment are not needed, the method can reduce the energy consumption. Moreover, the method is applicable to fields of structural materials and composite materials with high requirements for insulation and electrical properties, and can be easily promoted and implemented.

Description

technical field [0001] The invention relates to an epoxy resin bulk molding compound and a preparation method thereof. Background technique [0002] Molding compound technology is a mature composite material technology. It is used by mixing resin and fiber evenly, and has the characteristics of uniform and stable quality, fast molding speed and high production efficiency. Common molding compounds mainly use polyester resin as the resin matrix, which has the characteristics of low cost and low curing temperature. Using epoxy resin as the resin matrix of molding compounds has unique advantages in some special technical fields. Long storage period, high glass transition temperature, good mechanical properties and electrical properties and other fields. [0003] At present, there are few formulations using epoxy resins as raw materials for molding compounds, all of which use latent curing systems. Most of them need to be matured before they can be used, and the process is relat...

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Problems solved by technology

[0003] At present, there are few formulations using epoxy resins as raw materials for molding compounds, all of which use latent curing systems. Most of them need to be matured before they can be used, and the process is relatively complicated; as the Chinese patent application with publication number CN101096443A discloses a kind of epoxy resin The preparation method of the sheet molding compound is to prepare the epoxy resin paste, add chopped fiber and mix evenly, then make a sheet with a scraper, and then thicken it in an oven for 24-96 hours to mature, and control the thickening temperature to 28 -40℃, get epoxy resin sheet molding compound

The curing process is an indispensable process in the preparation of the existing epoxy resin molding compound. It consumes energy, is difficult to operate and has low production efficiency.