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Pb-free solder compositions and PCB and electronic device using same

A printed circuit board, lead-free solder technology, applied in the directions of printed circuit, printed circuit manufacturing, electrical components, etc., can solve the basic performance of solder, i.e. decrease in bondability, increase the influence of slag and discoloration, increase melting temperature and other problems , to achieve the effect of improving bondability, improving mechanical properties and preventing oxidation

Inactive Publication Date: 2013-10-23
株式会社爱科草英
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0020] In addition, due to the erosion of the copper pad in the PCB, when the copper concentration increases above 1%, the melting temperature of the solder increases rapidly and the wettability decreases
This would require the entire lead bath to be replaced or could cause cracking
[0021] Additionally, when only silicon is added, the effect on dross and discoloration is enhanced
However, if the content of silicon exceeds a certain amount, the basic performance of solder, that is, the bonding property will be reduced.

Method used

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  • Pb-free solder compositions and PCB and electronic device using same
  • Pb-free solder compositions and PCB and electronic device using same
  • Pb-free solder compositions and PCB and electronic device using same

Examples

Experimental program
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Effect test

Embodiment approach 1

[0065] This embodiment provides a lead-free solder composition and a PCB and an electronic device using the lead-free solder composition, the composition includes silver from 0.1wt%-4.0wt%, copper from 0.1wt%-2wt%, 0.001wt%-0.05wt% of silicon, 0.001wt%-0.01wt% of cobalt, and the balance of tin.

[0066] The following will refer to figure 1 Explain the role of the composition of silicon and cobalt in preventing oxidation.

[0067] figure 1

[0068]

[0069] (Amount of oxidation: amount of oxide; oxidation rate: oxidation rate; comparative example: comparative example; example: embodiment; after 1 hour: after 1 hour; after 2 hours: after 2 hours; after 3 hours: after 3 hours.)

[0070] figure 1 Experimental data of the amount of oxides measured by the following method are exemplified. Silicon and cobalt are added to the intended base alloy. The resulting alloy is melted to make a solder composition. The solder composition was heated to 260° C. on a hot plate in a 160 m...

Embodiment 2

[0318] The high temperature lead-free solder compound according to the present embodiment may include tin (Sn), copper (Cu), silicon (Si), and cobalt (Co).

[0319] The effect of the silicon and cobalt components on the prevention of oxidation will be described below with reference to FIG. 16 .

[0320] Figure 16 illustrates experimental data for the amount of oxides measured by the following procedure. A tin-copper based alloy is prepared and co-melted with either or both silicon and cobalt in a high frequency melting furnace to form a solder compound. After sampling the solder compound, its melting temperature was measured using DSC analysis at 5°C / min. Thereafter, in order to measure the amount of oxide, 3 kg of solder was heated to 420° C. in a SUS crucible having a diameter of 160 mm on a hot plane. Then, the solder compound was stirred at 60 rpm using a stirrer having a diameter of 140 mm for 1 hour, 2 hours, and 3 hours, and oxides were extracted therefrom each time a...

Embodiment 3

[0399] The lead-free solder compound for dilution according to the present embodiment may include nickel (Ni), silicon (Si), phosphorus (P), cobalt (CO), and tin (Sn).

[0400] The effect of the silicon and cobalt components on preventing oxidation will be described below with reference to FIG. 20 .

[0401] Figure 20 illustrates experimental data for the amount of oxides measured by the following procedure. Silicon and cobalt are added to the Sn-Ni-P based alloy. The resulting alloy is melted to produce a solder compound. On a hot plane, the solder compound was heated to 260° C. in a SUS crucible with a diameter of 160 mm. Then, the solder compound was stirred at 60 rpm using a stirrer having a diameter of 140 mm for 1 hour, 2 hours, and 3 hours, and oxides were extracted therefrom each time and weighed.

[0402] Thereafter, the solder was allowed to solidify, and then a solder sample was cut from the solder. Polish the cut surface of the solder sample. Then, the composi...

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Abstract

Provided is a lead-free solder composition, including at least two of tin (Sn), silver (Ag), phosphorous (P), nickel (Ni), copper (Cu), bismuth (Bi) and germanium (Ge), and including both silicon (Si) and cobalt (Co), for preventing the deterioration of workability caused by the oxidation of the solder alloy and eliminating the need of replacing the whole lead bath caused by the increase of the copper erosion during soldering, and a printed circuit board (PCB) and an electronic device using the lead-free solder. Through the lead-free solder composition including both silicon and cobalt, and the printed circuit board (PCB) and the electronic device using the lead-free solder, it is possible to constantly prevent the formation of the oxides, prevent the discoloration and the erosion of the copper pad, improve the mechanical properties and the soldering joinability while maintaining the wettability during the soldering.

Description

technical field [0001] The present invention relates to a lead-free solder composition and a printed circuit board (PCB) and an electronic device using the lead-free solder composition, and more particularly, relates to a lead (Pb)-free solder composition which is harmful to the human body. Lead solder composition and PCB and electronic device using the lead-free solder composition comprising tin (Sn), copper (Cu) and silver (Ag) added with silicon (Si) and cobalt (Co) Ternary composition, tertiary composition of tin, copper, silver and nickel added to silicon and cobalt, tin, copper, silver, nickel, germanium (Ge) and phosphorus (P) added to silicon and cobalt A six-component composition, or a quaternary composition of tin, copper, phosphorus, and bismuth (Bi) with added silicon and cobalt, in order to improve the work efficiency of welding by continuously preventing oxidation with the help of silicon added therein, in With the help of a small amount of silicon added, discol...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B23K35/26
CPCH05K3/3463B23K35/262
Inventor 高明玩朴商福宋明圭朴玧秀李光烈
Owner 株式会社爱科草英
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