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Heat radiator with composite structure and preparation method thereof

A composite structure and heat sink technology, applied in heat exchange equipment, lighting and heating equipment, electric solid devices, etc., can solve problems such as suboptimal heat dissipation efficiency, increased production costs, and decreased directional thermal conductivity

Active Publication Date: 2010-09-08
湖北联投恒达石墨有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the problem of small heat capacity of the fin material is not solved, and the heat dissipation efficiency is not optimal.
Moreover, although the thermal conductivity of the heat sink is changed from two-dimensional to three-dimensional by crushing, impregnating and graphitizing methods, it is inevitable that the directional thermal conductivity decreases, and the time required for graphitization by heating in the final step of preparation About 1 month, increasing production cost

Method used

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  • Heat radiator with composite structure and preparation method thereof
  • Heat radiator with composite structure and preparation method thereof
  • Heat radiator with composite structure and preparation method thereof

Examples

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Effect test

preparation example Construction

[0035] A preparation method of a composite structure graphite radiator, comprising the following steps:

[0036] 1) impregnating expandable graphite with paraffin in a vacuum impregnation box, the amount of paraffin impregnated is 85%±5% of the total weight of the finished product, and compacted to make a plurality of long fins 1;

[0037] 2) The thermal conduction layer 7 and the plurality of short fins 2 are made of a flexible graphite plate with a density of 1.1-1.7g / cm3;

[0038] 3) A plurality of long fins 1 and a plurality of short fins 2 are arranged staggeredly, one end is aligned, and the clamping device is used to install firmly. Except for the aligned end faces, the other three end faces are sealed with PET single-sided adhesive film;

[0039] 4) Polish the aligned end faces, and install the heat conducting layer 7 on the end faces.

[0040] The flexible graphite plate adopts the expanded graphite foam plate of 0.2-0.3g / cm3, and then dissolves the thermosetting phe...

Embodiment 1

[0045] Use 50-mesh flake graphite, use concentrated sulfuric acid and nitric acid to carry out oxidation intercalation reaction according to a certain ratio, wash and dry to obtain expandable graphite, expandable graphite expands at 850°C, and the expansion ratio is 200 times, and the expanded graphite is pressed into density It is 0.2g / cm3 plate, and the thickness of the plate is 3mm. According to the size of the dipping tank, the plate specification is designed to be 500x500mm.

[0046] Use paraffin as the energy storage phase change material, the phase change temperature is 58°C, and the phase change heat is 190KJ / kg. Melt the phase change paraffin in the container, and use the vacuum impregnation box to enter the low-density expanded graphite In the vacuum box of the plate, the vacuum box is kept at 65°C, and the vacuum degree of the vacuum box equipped with the graphite plate is kept at -0.095MPa before the paraffin is inhaled.

[0047] After the graphite plate is impreg...

Embodiment 2

[0059] The manufacturing method of the expanded graphite paraffin composite board is the same as in Example 1.

[0060] Manufacture 0.2g / cm expanded graphite foam plate according to embodiment 1, then thermosetting phenolic resin is dissolved into the solution that concentration is 20% with dehydrated alcohol, adopts the method for vacuum impregnation, impregnates thermosetting phenolic resin in graphite plate, impregnated After the graphite plate is dried, it is pulverized with a plastic pulverizer, and then pulverized into an 80-mesh powder with a stirring mill, and hot-pressed into a 1.7g / cm 3 Graphite plates with a density of 2mm and a thickness of 0.18mm are used to process high-strength flexible graphite plates into parts with mounting holes, and the size of the parts is 50x50mm. The graphite plate is cured at a temperature of 175°C to obtain a high-strength flexible graphite plate. The thermal conductivity of the high-strength flexible graphite plate in the plate direc...

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Abstract

The invention discloses a heat radiator with a composite structure, which relates to the field of electronic products heat radiators. A plurality of long fins made from expandable graphite composite materials and a plurality of short fins made from flexible graphite materials are staggered in a clamping device, wherein the long fins align with one ends of the short fins, the aligned end face is provided with a heat-conducting layer which is made of flexible graphite material or metal materials and has the thickness of 0.15-0.2 mm. The invention fully takes the advantage of the high heat conductivity of the flexible graphite plate material in the plane direction, optimizes a heat-conducting structure when the high heat conductivity of the flexible graphite plate material and the high heat-tolerance performance of the expandable graphite composite material are matched, forms a favorable three-dimensional heat dissipation effect and has light weight, little heat resistance, favorable contact, controllable temperature, short production cycle and low production cost. The invention also relates to a preparation method of the heat radiator.

Description

technical field [0001] The invention relates to the field of heat dissipation devices for electronic products, in particular to a graphite radiator with a composite structure suitable for heat dissipation of integrated circuit chips and a preparation method thereof. Background technique [0002] At present, the rapid development of integrated circuit technology has led to the smaller and smaller volumes of various electronic devices and products, and the heat flux around integrated devices is increasing. Taking computer CPU as an example, the heat flux generated during its operation has reached 60 -100W / cm 2 , even up to 103W / cm in semiconductor lasers 2 Magnitude. On the other hand, the reliability of electronic devices is very sensitive to temperature, and the reliability will drop by 5% for every 1°C increase in device temperature at the level of 70-80°C. Higher temperature levels have increasingly become the bottleneck restricting the performance of electronic devices...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): F28F3/02H01L23/373
CPCF28F3/02F28F21/02
Inventor 傅云峰李云峰王凤军
Owner 湖北联投恒达石墨有限公司
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