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Method for packaging white LED locally sprayed with fluorescent powder and fluorescent powder local coating structure

A technology of LED packaging and phosphor powder, which is applied in the direction of electrical components, electric solid devices, circuits, etc., to achieve the effect of uniform light color, wide applicability, and not easy to precipitate

Inactive Publication Date: 2013-01-16
江苏米优光电科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0009] The technical problem to be solved by the present invention is: to provide a white LED packaging method with partial spraying of phosphor powder, the local coating of phosphor powder on the LED chip area can eliminate the problem of uneven light color of white light LED caused by phosphor powder

Method used

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  • Method for packaging white LED locally sprayed with fluorescent powder and fluorescent powder local coating structure
  • Method for packaging white LED locally sprayed with fluorescent powder and fluorescent powder local coating structure
  • Method for packaging white LED locally sprayed with fluorescent powder and fluorescent powder local coating structure

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Embodiment 1

[0052] The invention provides a white light LED packaging method in which fluorescent powder is partially coated on a chip by a spraying method. After the LED chip is solidified and wire-bonded on the power type bracket, the LED bracket is placed in a mold to expose the chip and the edge area. Use the atomizing nozzle of the automatic dispensing machine to atomize the sprayed phosphor colloid, and the fine phosphor powder droplets on the chip surface and side wall are connected to form a film, and on the heat sink of the bracket, because of the special plasma surface During processing, the contact angle between the glue droplets and the heat sink metal is large and mainly gather around the chip. In this way, a uniform film of fluorescent powder colloid is formed around the chip, and after thermal curing or ultraviolet curing, a partial coating of LED fluorescent powder is formed.

[0053] According to the technical solution of the present invention, the structure of the local...

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Abstract

The invention discloses a method for packaging a white LED locally sprayed with fluorescent powder. The method comprises the following steps: after an LED chip is subjected to die bonding and wire bonding on a power bracket, putting the LED bracket into a die, and exposing the chip and an edge area; atomizing the sprayed fluorescent powder by using an atomizing nozzle of an automatic glue dispenser, and connecting fine fluorescent powder glue drops on the surface and side wall of the chip into a film; treating the surface of a heat sink of the bracket by using plasmas, and mainly converging the glue drops at the periphery of the chip; and forming a layer of uniform fluorescent powder glue film, and forming the local coating of the LED fluorescent powder after thermocuring or ultraviolet curing. The photochromic uniformity of the white LED is improved; and because the fluorescent powder forms the uniform coating layer on the surface and the side face of the chip through surface tension, the ratios of fluorescence excitation and chip emitting light in various directions are almost equal, and the photochromism is uniform.

Description

technical field [0001] The invention belongs to the technical field of LED packaging, and relates to a white LED packaging method, in particular to a white LED packaging method in which phosphor powder is partially sprayed on an LED chip; at the same time, the invention also relates to a phosphor powder partially coated by the above method. structure. Background technique [0002] Semiconductor lighting has been widely valued because of energy saving, environmental protection, and long life, and white light-emitting diodes (LEDs) are the core components of semiconductor lighting. [0003] At present, there are three main methods for preparing white light LEDs: mixing three primary color LEDs into white light through a certain light intensity ratio; or converting monochromatic LEDs into white light LEDs through phosphor powder technology; A LED chip that directly emits white light is obtained. [0004] However, the commonly used white light LED preparation method in the mar...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L33/48H01L33/50
CPCH01L2224/48463
Inventor 宋金德陈志忠张茂胜董维胜张国义
Owner 江苏米优光电科技有限公司
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