Method for manufacturing thermoelectric module having high-insulation thermal coupling surface, low thermal resistance and no brazing layer

Abstract

The invention relates to a method for manufacturing a thermoelectric module having a high-insulation thermal coupling surface, low thermal resistance and no brazing layer. The method comprises the following steps: manufacturing an insulated frame which is embedded with at least two metal electric-connection terminals by an injection molding method; preparing thermoelectric elements; placing the thermoelectric elements in through holes of the insulated frame; respectively spraying metal coating on the upper ends and the lower ends of the thermoelectric elements; grinding the sprayed surfaces; and covering an alumina film layer on the grounded surfaces respectively, wherein the insulated frame is provided with a plurality of through holes in which thermoelectric elements are placed; grooves of which the number corresponds to that of the metal electric-connection terminals are formed in side frames of the insulated frame and are communicated with different through holes; the first end parts of the metal electric-connection terminals are respectively arranged in the grooves, while the second end parts are positioned outside the side frames of the insulated frame. The thermoelectric module manufactured by the manufacturing method has the high-insulation thermal coupling surface, the low resistance and no brazing layer, and has the characteristics of improvement on the reliability of the electric connection between the thermoelectric elements and an external system, simplification of operation steps, reduction of material cost, excellent performance, and suitability for large-scale generalization and application.

Description

technical field [0001] The invention relates to the technical field of thermoelectric device manufacturing, in particular to the technical field of thermoelectric module manufacturing, and specifically refers to a method for manufacturing a thermoelectric module with no brazing layer, high insulation of the thermal coupling surface, and low thermal resistance. Background technique [0002] A thermoelectric device is a functional device that uses the Seebeck effect or Peltier to directly convert thermal energy and electrical energy. It has the characteristics of small size, light weight, no moving parts, no noise, and high reliability. It is used in scientific research, aerospace, It has been applied in optical communication, instrumentation and automobiles, currently bismuth tritelluride (Bi 2 Te 3 )-based semiconductor material is the material with the highest conversion efficiency in the working range of 200K to 500K. Most of the thermoelectric materials based on Bi2Te3 a...

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Problems solved by technology

[0003] 1. When the device is at a higher temperature, the solder is easy to diffuse into the thermoelectric element, resulting in rapid degradation of device performance, which affects the application of the device at higher temperature

[0004] 2. When the thermoelectric device is working, there is a large temperature difference between the two thermal coupling surfaces. The thermal coupling surface and the element form a rigid structure through brazing. Due to thermal expansion, the brazing surface of the thermoelectric element is subjected to a large shear stress. , the farther away from the geometric center, the greater the stress, which restricts the further increase of the area of ​​the thermoelectric device

[0005] 3. Thermoelectric devices are often affected by temperature, humidity, current and the oxidizing atmosphere in the atmosphere when they are working, which affects the reliable operation of the device

This connection method has low production efficiency and poor consistency. The main problem is that the copper wire 103 is easily separated from the thermoelectric element 102 during subsequent processing or installation and disassembly, which makes the device fail prematurely and affects the reliability of the device.

[0008] 2. Bond a layer of polyimide film 105 as an electrical insulation layer on the electrically connected metal layer 104 between thermoelectric elements, and bond an aluminum sheet 106 on the outside of the polyimide film 105, such as image 3 As shown, although the purpose of electrical insulation can be achieved in this way, the thermal resistance is relatively large, which affects the conversion efficiency of the device.

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