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Micro reflector array manufacturing method

A technology of a micro-mirror array and a manufacturing method, which is applied in the directions of optical elements, optics, instruments, etc., can solve the problems of high filling factor, high driving voltage, small twist angle, etc.

Active Publication Date: 2011-04-13
THE 13TH RES INST OF CHINA ELECTRONICS TECH GRP CORP
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  • Abstract
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Problems solved by technology

[0009] The technical problem to be solved by the present invention is to provide a method for manufacturing micro-mirror arrays to solve the problems of low filling factor, small twist angle and high driving voltage of current mirrors, so as to achieve high filling factor, large-angle twist, and low-voltage drive. The purpose of the micromirror array

Method used

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Embodiment Construction

[0034] image 3 It is a top view of a unit in a micro-mirror array. The mirror material is a polished silicon surface. The smooth silicon surface has a high reflectivity to reduce light reflection loss. The surface of the mirror has a supporting pillar release hole.

[0035] Figure 4 It is a cross-sectional view of a unit in the micro-mirror array. It consists of a substrate glass sheet 1, a driving structure layer silicon chip 2 and a mirror layer silicon chip 3 bonded together by a wafer bonding process, including a movable driving comb 4, reflecting Mirror 5, bonding metal layer (moving tooth drive electrode) 6, release hole 7, twist beam 8, fixed tooth drive electrode (1) 9, fixed drive comb 10, support column (after release) 11, fixed tooth drive electrode (2) 12, wherein there are metal wiring on the surface of the substrate glass sheet 1 and the driving structure layer silicon sheet 2. The working principle is as follows: the fixed-tooth drive comb 10 is connected to the ...

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Abstract

The invention discloses a micro reflector array manufacturing method which is used for manufacturing micro reflector array with high fill factors, big-angle torsion and big array. The method adopts bulk-silicon MEMS processing technology, a vertical comb driving mode, wafer bonding technology and etching technology and is characterized in that the wafer is bonded after a middle driver layer is processed, a layer of reflector surface is covered above the driver layer; on the basis, a deep etching release technology is adopted to release a shore reserved in the driver layer to realize micro reflector torsion, thus realizing the purpose of driving with high fill factors, big-angle torsion and low voltage.

Description

Technical field [0001] The invention relates to a method for manufacturing a micro-mirror array, which is particularly suitable for manufacturing a micro-mirror array with a large array, a large-angle twist, and a high filling factor. Background technique [0002] MOEMS (Micro-Optical Electromechanical System) is an integrated system of light, machine, and electricity. The development of information technology and optical fiber communication technology makes MOEMS a hot spot in current research. Its applications cover optical communication, optical display, data storage, Adaptive optics and optical sensing and other aspects. New optical devices made by MEMS technology have low insertion loss, extremely low crosstalk between optical paths, insensitive to light wavelength and polarization, and usually use silicon as the main material, so the optical, mechanical and electrical properties of the device are excellent. [0003] The core element that changes the direction of "light" in M...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G02B26/08
Inventor 徐永青杨拥军李艳丽
Owner THE 13TH RES INST OF CHINA ELECTRONICS TECH GRP CORP
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