Etching solution for use in wet etching of bismuth-based thin films
A wet etching and etching solution technology, applied in the field of materials, can solve problems such as difficulty in etching bismuth-based thin film materials, inability to guarantee pattern accuracy, etc., and achieve the effect of effective control of pattern precision, clear pattern and clean surface
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[0034] The chemicals used in this method include but are not limited to the following raw materials: concentrated hydrofluoric acid (analytical pure, ≥40%), concentrated nitric acid (analytical pure, 65~68%), ammonium fluoride crystals (analytical pure, ≥98%), Deionized water.
[0035] 1) First weigh an appropriate amount of HF (analytical pure) solution with a plastic measuring cylinder and pour it into a plastic beaker, then weigh the required amount of deionized water in the formula and pour it into the beaker together. Stir the solution well with a plastic stick.
[0036] 2) Weigh NH with an electronic balance 4 F (analytical pure), the weighed NH4F is added in the HF aqueous solution, and it is fully dissolved.
[0037] 3) Weigh the required amount of nitric acid (concentration: 65-68%) with a glass calciner and add the prepared HF, NH 4 F aqueous solution.
[0038] 4) Putting the prepared substrate into the etching solution for etching.
[0039] The specific experim...
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