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Aluminum honeycomb type evaporation plate and processing molding method thereof

A technology for processing and forming aluminum alloy plates, applied in metal processing equipment, forming tools, manufacturing tools, etc., can solve the problem of aluminum alloy profile wall thickness, complex structure forming, unstable quality of aluminum alloy evaporation plates, heat exchange of evaporation plates Efficiency is not too high, to achieve the effect of not easy to form dead angle, prevent deformation and warping, and improve cooling effect

Inactive Publication Date: 2010-04-07
CHONGQING UNIV
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  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0004] Ordinary aluminum alloy evaporating plates are parallel flow evaporating plates welded by aluminum alloy profiles. The thickness of the aluminum alloy profiles and the complex structure make the aluminum alloy parallel flow evaporating plates heavy in weight, consume a lot of aluminum alloy materials, and cost high , and the quality of the aluminum alloy evaporating plate formed by the conventional fusion welding process is not stable, and the heat exchange efficiency of the evaporating plate is not too high

Method used

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  • Aluminum honeycomb type evaporation plate and processing molding method thereof
  • Aluminum honeycomb type evaporation plate and processing molding method thereof
  • Aluminum honeycomb type evaporation plate and processing molding method thereof

Examples

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Embodiment 1

[0052] see figure 1 or figure 2 or image 3 , two 6063 aluminum alloy plates with a length of 1.5m, a width of 0.8m, and a thickness of 1.8mm are processed and processed. Rolling to form micro-patterns on the surface, adopting the method of friction stir welding, welding two aluminum alloy plates with a welding process of 800r / min and welding speed of 150mm / min to form honeycomb solder joints with a total of 880 equidistant points. The length of 4 isolation welds is 1300mm, and the surroundings are sealed and welded together; the aluminum-copper composite inlet pipe and the aluminum-copper composite outlet pipe are sealed and connected with the aluminum alloy evaporation plate body by arc welding; the inflation positioning mold is used, and the high-pressure gas The aluminum alloy evaporating plate is bulged to form a honeycomb evaporating plate with hollow channels and dimple-like corrugations on the surface; then perform other post-welding processes and apply pressure, su...

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Abstract

The invention discloses an aluminum honeycomb type evaporation plate and a processing molding method thereof. The evaporation plate adopts a high strength aluminum alloy plate and consists of an upper plate, a lower plate, an inlet pipe and an outlet pipe, wherein the two high strength aluminum alloy plates are overlapped and welded together by a solid-phase stir friction connecting method; the inlet pipe and the outlet pipe are inserted in the upper end and the lower end between the two high strength aluminum alloy plates and are connected with the high strength aluminum alloy evaporation plate body by using an electric arc welding method; and then the evaporation plate is finally molded through a mould and high-pressure bulging technology.

Description

technical field [0001] The invention relates to the field of welding technology, in particular to an aluminum alloy honeycomb evaporation plate and a processing and forming method thereof. Background technique [0002] Ordinary honeycomb evaporator plates are generally welded by two 1-3mm thick 304 stainless steel plates with a length of 1.2-1.8m and a width of 0.5-1.2m by resistance seam welding. Bulging, so that it can be shaped into a honeycomb evaporator plate with a hollow channel with dimple-like corrugations on the surface, allowing the refrigerant (such as R-22 or ammonia) to flow in the hollow channel. Due to the large number of weld beads and dense distribution on the honeycomb evaporator plate, the welding heat input of the resistance seam welding method is relatively large, and because the stainless steel linear expansion coefficient is large and the thermal conductivity is low (about 17w / m×kJ), it is easy to generate heat during resistance welding. The large we...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): F28F3/12B23P15/26B23K20/12B23K9/00B21D26/02B21D37/01B21D37/10B21D26/021
CPCF28F3/14
Inventor 罗键
Owner CHONGQING UNIV
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