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Method for manufacturing micropores for electric conduction among copper foil of high-density multilayer circuit boards

A multi-layer circuit board and manufacturing method technology, applied in the direction of electrical connection formation of printed components, etc., can solve the problems of large discharge of organic and acidic pollutants, low production efficiency, high cost of Excimer lasers, etc.

Inactive Publication Date: 2009-11-25
XI AN JIAOTONG UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

However, due to the low energy density of general YAG lasers after triple frequency, the precession cutting method must be adopted when drilling, instead of CO 2 Laser drilling dielectric boards use a laser pulse to instantly drill through the copper foil, so the production efficiency is very low
[0007] (3) Due to high cost and inconvenient maintenance, Excimer lasers have not yet been applied in HDPCB manufacturing
The discharge of organic and acidic pollutants due to photolithography and etching processes is very large
In some areas of our country, many such production lines of multinational companies are concentrated, causing serious pollution to the environment.

Method used

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  • Method for manufacturing micropores for electric conduction among copper foil of high-density multilayer circuit boards
  • Method for manufacturing micropores for electric conduction among copper foil of high-density multilayer circuit boards
  • Method for manufacturing micropores for electric conduction among copper foil of high-density multilayer circuit boards

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Experimental program
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Effect test

Embodiment 1

[0034] The micropore manufacturing method of the present embodiment is carried out according to the following steps:

[0035] (1) First paste a layer of insulating tape 4 on the surface copper foil 1 of the high-density multilayer circuit board (such as figure 2 );

[0036] (2) Use 20J / cm 2 Density pulsed carbon dioxide laser micro-beams ablate the insulating tape 4 at the microhole to be drilled to form the microhole 5 of the insulating tape, so that the surface copper foil 1 at the microhole to be drilled is exposed (such as image 3 );

[0037] (3) electroplating a layer of tin-containing metal layer 6 with a thickness of 4.5 microns (such as Figure 4 ), the tin-containing metal layer 6 is partially electroplated with a tin-silver alloy;

[0038] (4) peel off the insulating tape 4 pasted on the surface copper foil 1, and only have the tin-containing metal layer 6 at the microhole to be drilled on the surface of the copper foil (such as Figure 5 ).

[0039] (5) Use ...

Embodiment 2

[0042] The micropore manufacturing method of the present embodiment is carried out according to the following steps:

[0043] (1) First paste a layer of insulating tape 4 on the surface copper foil 1 of the high-density multilayer circuit board (such as figure 2 );

[0044] (2) Use 20J / cm 2 Density pulsed carbon dioxide laser micro-beams ablate the insulating tape 4 at the microhole to be drilled to form the microhole 5 of the insulating tape, so that the surface copper foil 1 at the microhole to be drilled is exposed (such as image 3 );

[0045] (3) Electroplating a layer of pure tin metal layer 6 with a thickness of 5.0 microns on the surface copper foil 1 exposed to the micro-hole to be drilled, the pure tin metal layer 6 adopts a partial electroplating method; the electroplating solution adopts commercially available tin electroplating solution, the electroplating process conditions are as follows:

[0046] Composition Rack Plating

[0047] SnSO 4 40 g / l...

Embodiment 3

[0059] The micropore manufacturing method of the present embodiment is carried out according to the following steps:

[0060] (1) First paste a layer of insulating tape 4 on the surface copper foil 1 of the high-density multilayer circuit board (such as figure 2 );

[0061] (2) Use 20J / cm 2 Density pulsed carbon dioxide laser micro-beams ablate the insulating tape 4 at the microhole to be drilled to form the microhole 5 of the insulating tape, so that the surface copper foil 1 at the microhole to be drilled is exposed (such as image 3 );

[0062] (3) Electroplating a layer of pure tin metal layer 6 with a thickness of 5.0 microns on the surface copper foil 1 exposed to the micro-hole to be drilled, the pure tin metal layer 6 adopts a partial electroplating method; the electroplating solution adopts commercially available tin electroplating solution, the electroplating process conditions are as follows:

[0063] Composition Rack Plating

[0064] SnSO 4 40 g...

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Abstract

The invention discloses a method for manufacturing micropores for electric conduction among copper foil of high-density multilayer circuit boards. The method comprises: depositing a tin-containing metal layer in a position where a micropore is to be drilled on surface copper foil of a high-density multilayer circuit board by a local electroplating method; using a pulsed carbon dioxide laser microbeam to drill a hole in the position plated with the tin-containing metal layer so as to ensure that the surface copper foil on the bottom of the tin-containing metal layer is melted to form a copper-foil micropore; and aiming the pulsed carbon dioxide laser microbeam at the copper-foil micropore of the surface copper foil to drill a substrate medium hole on a substrate medium under the copper-foil micropore up to interlayer copper foil. The method integrates a drilling process for copper conductive layers with a drilling process for dielectric substrates in the manufacture of the high-density circuit boards, thereby greatly simplifying production process, avoiding the emission of a large number of acidic and organic pollutants and achieving the aims of reducing cost and protecting environment.

Description

technical field [0001] The invention belongs to the field of manufacturing high-density printed circuit boards, and relates to an interlayer connection technology in the manufacture of high-density printed circuit boards, in particular to a microhole manufacturing method for conducting electricity between copper foils of high-density multilayer circuit boards. Background technique [0002] It is a constant technical pursuit to improve integration and reduce product volume and weight in modern electronic manufacturing industry. Various smart and portable electronic devices (such as notebook computers, mobile communications, mobile medical instruments, etc.) are widely used in daily life and national defense construction. Due to the rapid development of large-scale integrated circuit technology, the volume of the circuit board is an important factor restricting the further miniaturization of high-reliability electronic products. So a high-density wiring multilayer circuit boa...

Claims

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Application Information

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IPC IPC(8): H05K3/42
Inventor 方湘怡刘纯龙王红理李正谢永红程向明
Owner XI AN JIAOTONG UNIV
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