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Polyimide film with high visible light permeability and preparation thereof

A technology of polyimide film and visible light, which is applied in the field of high visible light transmittance polyimide film and its preparation, can solve the problem that it is difficult to prepare high molecular weight polyimide resin, and there are no published documents or patents Reporting, film product comprehensive performance decline and other issues, to achieve excellent dimensional stability, low cost, and fewer types of use

Inactive Publication Date: 2009-11-25
DONGHUA UNIV +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0007] Its shortcoming is: (1) used raw material 2,2-bis(3,4-dicarboxyphenyl) hexafluoropropane dianhydride monomer is extremely expensive, causes the cost of film product to be very high, has seriously hindered its further popularization and application; ( 2) Due to the low reactivity of 2,2-bis(3,4-dicarboxyphenyl) hexafluoropropane dianhydride monomer and aromatic dibasic primary amine, it is difficult to prepare high molecular weight polyimide resin, Therefore, the overall performance of its film products is greatly reduced, especially its mechanical properties.
[0012] The molecular structure and preparation method of the high visible light transmittance polyimide film disclosed by the present invention have not yet been published in the literature or patent reports

Method used

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  • Polyimide film with high visible light permeability and preparation thereof
  • Polyimide film with high visible light permeability and preparation thereof
  • Polyimide film with high visible light permeability and preparation thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0056] 23.8 g (0.1 mole) of 3,3'-dimethyl-4,4'-diaminodicyclohexylmethane, 40.0 g (0.1 mole) of 4,4'-bis(4-aminophenoxy) di Phenylsulfide and 900 ml of N, N-dimethylacetamide were put into the reaction kettle, stirred, and after they were completely dissolved, cooled to 5°C-10°C in an ice-water bath, and 104.1 grams (0.2 moles) of 2,2-bis [4-(3,4-dicarboxyphenoxy)phenyl]propane dianhydride, stirred in the temperature range of 5°C-10°C, after completely dissolving, keep the reaction for 4 hours to obtain homogeneous transparent viscous Polyamic acid solution.

[0057] Use N,N-dimethylacetamide solvent to adjust the viscosity of the polyamic acid solution so that it is between 80 seconds and 120 seconds (No. 4 viscosity cup), form a film in a casting machine, and heat up to remove Remove the organic solvent (recycle and reuse) and carry out dehydration heat imidization reaction, cooling, and stripping to obtain a tough and transparent polyimide film (thickness: 50 microns). Th...

Embodiment 2

[0061] 65.4 grams (0.1 mol) of 2,2-bis[4-(2-trifluoromethyl-4-aminophenoxy)phenyl]hexafluoropropane, 200 milliliters of N,N-dimethylformamide and 400 milliliters of N,N-dimethylacetamide was put into the reaction kettle, stirred, and after it was completely dissolved, cooled to 5°C-10°C in an ice-water bath, and 52.0 grams (0.1 moles) of 2,2-bis[4-( 3,4-Dicarboxyphenoxy)phenyl]propane dianhydride, stirred within the temperature range of 5°C-10°C, after completely dissolving, keep the reaction for 10 hours to obtain a homogeneous transparent viscous polyamic acid solution .

[0062] Use N,N-dimethylacetamide solvent to adjust the viscosity of the polyamic acid solution so that it is between 80 seconds and 120 seconds (No. 4 viscosity cup), form a film in a casting machine, and heat up to remove Remove the organic solvent (recycle and reuse) and carry out dehydration heat imidization reaction, cooling, and stripping to obtain a tough and transparent polyimide film (thickness: 5...

Embodiment 3

[0066] 54.7 grams (0.1 moles) of 2,2-bis[4-(2-trifluoromethyl-4-aminophenoxy)phenyl]propane, 51.8 grams (0.1 moles) of 2,2-bis[4 -(4-Aminophenoxy)phenyl]hexafluoropropane and 950 ml of N-methyl-2-pyrrolidone solvent were put into the reaction kettle, stirred and dissolved completely, cooled to 5°C-10°C in an ice-water bath, and added 104.1 grams (0.2 moles) of 2,2-bis[4-(3,4-dicarboxyphenoxy)phenyl]propane dianhydride, stirred in the temperature range of 5°C-10°C, after completely dissolving, maintain After reacting for 8 hours, a homogeneous transparent viscous polyamic acid solution was obtained.

[0067] Use N-methyl-2-pyrrolidone solvent to adjust the viscosity of the polyamic acid solution so that it is between 80 seconds and 120 seconds (No. 4 viscosity cup), form a film in a casting machine, and heat up to remove Organic solvent (recycling) and thermal imidization reaction for dehydration, cooling, and film removal to obtain a tough and transparent polyimide film (film...

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Abstract

The invention related to a polyimide film with high visible light permeability, molecular structure formula of which is: (shown in figure). Preparation comprises steps of: dissolving primary diamine in a strongly polarnon-proton solvent, cooling the same by cold water to 5 DEG. C to 10 DEG. C, adding aromatic dianhydride, mixing, reacting 4h to 10h at 5 DEG. C to 10 DEG. C, acquiring homogeneous, transparent, sticky polyamic acid resin solution; wherein mol number of aromatic dianhydride is equal to that of primary diamine; adjusting viscosity of polyamic acid resin solution by N,N-dimethyl acetamide, forming film in a casting machine, heating to raise temperature, processing dehydration heat imidization, cooling, deciduating to acquire homogeneous and transparent polyimide thin film. The preparation method has mild reaction condition, sample to operate, low in cost and environmental friendly; mechanical property and thermal stability of the polyimide thin film are excellent with high visible light permeability reaching 94% and film thickness 50 micrometers.

Description

technical field [0001] The invention belongs to the field of polyimide film and its preparation, in particular to a polyimide film with high visible light permeability and its preparation method. Background technique [0002] Polyimide film is a kind of polymer material with excellent comprehensive properties. It has particularly excellent heat resistance, low temperature resistance, flame retardancy, electrical properties and mechanical properties. It is widely used in electronic microelectronics, aerospace , laser, photoelectric and other high-tech fields. [0003] However, traditional polyimide films, such as the KAPTON film produced by the American DUPONT company and the domestic H film, have a molecular structure of pyromellitic dianhydride, that is, the main monomer raw material is pyromellitic acid di Anhydride and 4,4'-diaminodiphenyl ether have low transmittance of visible light (wavelength 400nm-700nm), a large amount of absorption occurs at a wavelength of 500nm,...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08J5/18C08G73/10
Inventor 虞鑫海陈梅芳
Owner DONGHUA UNIV
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