Microwave high-temperature heating heat-generating material containing MoSi2 and preparation method thereof
A technology for high-temperature heating and heating materials, applied in microwave heating and other directions, can solve the problems of low high-temperature heating life, high cost of heating elements, slow heating speed, etc., and achieve the effects of good high-temperature oxidation resistance, low cost, and fast heating speed.
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Embodiment 1
[0034] (1) Select MoSi with an average particle size of about 80 μm as the base powder 2 Powder (purity generally greater than 95wt.%) and SiC powder with an average particle size of about 150 μm, MoSi 2 The proportions of SiC and SiC are respectively: 30wt.% and 70wt.%.
[0035] (2) The weighed MoSi 2 Powder and SiC powder were mixed on a ball mill with alcohol as solvent for 6 hours to obtain a mixture.
[0036] (3) Dry the above mixture to obtain a microwave high-temperature heating heating material.
Embodiment 2
[0038] (1) Select MoSi with an average particle size of about 100 μm as the base powder 2 Powder (purity generally greater than 95wt.%) and SiC powder with an average particle size of about 150 μm, MoSi 2 , SiC, water glass, high-temperature glue and water are respectively: 8wt.%, 30wt.%, 2wt.%, 10wt.% and 50wt.%. to increase or decrease.
[0039] (2) Firstly, the weighed MoSi 2 Powder and SiC powder were mixed on a ball mill with alcohol as a solvent for 8 hours to obtain a mixture. After the above mixture was dried, it was mixed with weighed water glass, high-temperature glue and water in a mixer for 1 hour to obtain a slurry.
[0040] (3) Select a plate, or block, or a container of a specific shape composed of thermal insulation materials as a solid carrier, and apply the slurry described in (2) on the solid carrier by means of spraying equipment or manually (coating Grooves of a certain depth can be carved on the surface of the solid carrier to be coated to increase the...
Embodiment 3
[0043] (1) Select MoSi with an average particle size of about 50 μm as the base powder 2 powder (purity generally greater than 95wt.%) and SiC powder with an average particle size of about 80 μm, and the sintering aid is SiO with an average particle size of about 50 μm 2 Powder, MoSi 2 , SiC and SiO 2 The content proportions of the three are respectively: 30wt.%, 67wt.% and 3wt.%.
[0044] (2) After mixing the above weighed powder on a ball mill for 12 hours with alcohol as a solvent, add 10 vol.% phenolic resin solution as a binder, and mix for another 6 hours to obtain a mixture.
[0045] (3) Dry the above-mentioned mixture material, grind it, and pass through a 60-mesh sieve.
[0046] (4) The above-mentioned sieved materials were pressed and formed on a flat vulcanizing machine, the forming pressure was about 30MPa, and the pressure was maintained for 30s, and then sintered at 1700°C under the protection of Ar gas in a high-temperature sintering furnace to obtain a micro...
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