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Copper alloy sheet and QFN package

A copper alloy plate and copper alloy technology, applied in electrical components, circuits, electrical solid devices, etc., can solve the problem of not being able to fully restrain the wire dragging burrs and blade wear, and achieve the effect of reducing blade wear and burrs.

Active Publication Date: 2009-09-09
KOBE STEEL LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the CDA194 alloy cannot sufficiently suppress the occurrence of wire drag burrs and blade wear, and therefore lead frame materials with excellent dicing processability are further demanded.

Method used

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  • Copper alloy sheet and QFN package
  • Copper alloy sheet and QFN package
  • Copper alloy sheet and QFN package

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0051] First, an embodiment of the first invention of the present invention is shown.

[0052] Copper alloys having the compositions No. 1 to 21 shown in Table 1 were melted under a charcoal coating in the air in a small electric furnace to melt an ingot with a thickness of 50 mm, a width of 80 mm, and a length of 180 mm. The front and back sides of the ingot were surface-cut by 5 mm each, and then hot-rolled at 950° C. to form a 12 mm-thick plate, and then the front and back sides of the plate were surface-cut by about 1 mm. In addition, since No. 20 had a large number of pores in the ingot, and No. 21 had hot rolling cracks, the steps after hot rolling were respectively stopped.

[0053] [Table 1] chemical composition (mass%, ** Standard: PPM), finishing processing rate (%)

[0054]

[0055] * The position of excess or deficiency.

[0056] These plate materials were annealed after cold rolling, and the plate thickness was adjusted to 0.15 mm by finish cold rolling. T...

Embodiment 2

[0081] Next, an embodiment of the second invention of the present invention is shown.

[0082] Copper alloys having compositions of No. 1 to 24 shown in Table 3 were melted under a charcoal coating in the air in a small electric furnace to melt an ingot with a thickness of 50 mm, a width of 80 mm, and a length of 180 mm. The front and back sides of the ingot were surface-cut by 5 mm each, and then hot-rolled at 950° C. to form a 12 mm-thick plate, and then the front and back sides of the plate were surface-cut by about 1 mm. In addition, since No. 23 had a large number of pores in the ingot, and No. 24 had hot rolling cracks, the steps after hot rolling were stopped.

[0083] [Table 3] chemical composition (mass%, ** Standard: PPM), finishing processing rate (%)

[0084]

[0085]

[0086] №18: Cu-Fe-P system * The position of excess or deficiency.

[0087] №19: Cu-Ni-Si system

[0088] These plate materials were annealed after cold rolling, then cold rolling and ann...

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Abstract

The invention relates to a QFN package which is provided with a lead frame formed by processing a copper alloy sheet containing 0.01 to 0.50% by mass Fe, 0.01 to 0.20% by mass P, and Cu and inevitable impurities as other components, having a micro Vickers hardness of 150 or above, a uniform elongation of 5% or below and a local elongation of 10% or below, or a copper alloy sheet containing 0.05 to 2% by mass Ni, 0.001 to 0.3% by mass P, 0.005 to 5% by mass Zn, and Cu and inevitable impurities as other components, having a micro Vickers hardness of 150 or above, a uniform elongation of 5% or below and a local elongation of 10% or below. Lead burrs formed during the dicing of the QFN package are short, and a dicing blade used for dicing the QFN package is abraded at a low wear-out rate.

Description

technical field [0001] The present invention relates to an electronic component having a semiconductor device and the like, particularly a QFN package having a copper alloy plate for a QFN package and a lead frame made of copper alloy which require dicing. Background technique [0002] As semiconductor devices, QFN packages have increased, and packages with external leads represented by conventional QFPs have been replaced by packages such as CSP and BGA without lead frames. [0003] This is because not only can the existing QFP production line be utilized, but also the mounting area can be miniaturized like BGA, and it can be thinned like CSP. In addition, since it has a metal lead frame, productivity is high, and package reliability is not as low as that of BGA. In addition, since a heat sink can be provided on the back surface, it is not necessary to assemble a heat sink separately from the heat dissipation surface like BGA and CSP, and cost reduction can be achieved. ...

Claims

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Application Information

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IPC IPC(8): C22C9/00C22C9/04C22C9/06H01L23/495
CPCH01L2924/0002
Inventor 三轮洋介西村昌泰尾崎良一桂进也
Owner KOBE STEEL LTD
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