Metal and metallic oxide etching printing ink, as well as preparation method and use thereof

Abstract

The invention provides a metal, metal oxide etching ink, a preparation method and the application thereof. The ink is prepared by non-volatile acid, water-soluble polymer, ink auxiliary agent and de-ionized water. The invention can be applied to etching metal or metal oxide such as metallic nickel, magnesium, stainless steel, tin indium oxide compound and the like by technologies such as screen painting, offset printing and planographic printing. Therefore, the invention has simple technique, convenient use, complete etch, neat lines, no lateral erosion phenomenon, and environment-friendly and economical material and process flow, so as to be widely applied to the electronics industry, finishing material and semiconductor industry.

Description

technical field [0001] The invention relates to an etching ink, in particular to a metal and metal oxide etching ink used in the fields of electronics, semiconductors, and fine chemicals, as well as its preparation method and application. Background technique [0002] Existing metals and metal compounds are widely used, such as indium tin oxide compounds for touch screen panels and solar cells, and magnesium, nickel, and copper plates for the semiconductor industry. During use, it is often necessary to etch part of the metal and metal oxide to form a circuit or insulation. The traditional etching method needs to use an acid-containing liquid etching tank, but before etching, it is necessary to use a protective glue to protect the parts that do not need to be etched. , After the etching is completed, remove the protective glue with strong alkali. Although this type of process has been very mature and widely used, a serious problem is that due to the need to apply protective ...

AI Technical Summary

Problems solved by technology

Although this type of process has been very mature and widely used, a serious problem is that due to the need to apply protective glue and remove the protective glue, as well as the large amount of waste acid and lye produced during the etching process, it brings very serious environmental pollution problems. Due to the implementation of the current environmental protection laws and regulations, it also brings great troubles and economic losses to the production enterprises.

[0003] Chinese patent application 00136167.8 (conductive film etchant and etching method) discloses an indium tin oxide etching ink using hydrochloric acid as an etchant. It is used under heating or at room temperature, and the concentration of hydrochloric acid is about 10-15. There is a serious defect in hydrochloric acid, because hydrochloric acid is a volatile acid. As we all know, hydrochloric acid is extremely volatile, and lower concentrations of hydrochloric acid also have a certain degree of volatility, especially when the temperature rises. In this way, when the ink is in the etching process In the process, the volatilized hydrochloric acid will etch the unprotected indium tin oxide part, thus greatly limiting its practical performance

In addition, the etching ink involved in this patent application simply mixes several raw materials. This kind of simple mixing leads to the phenomenon that the ink is easy to shrink and dry too quickly when it is used.