Wafer stage encapsulation LED chip and manufacturing method thereof
A light-emitting diode, wafer-level packaging technology, applied in semiconductor/solid-state device manufacturing, electrical components, electrical solid-state devices, etc., can solve the problems of poor heat dissipation, expensive equipment, and easy moisture.
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[0037] The present invention is a wafer-level packaged light-emitting diode chip and a manufacturing method thereof. As shown in FIGS. 1, 2, 5 and 8, the light-emitting diode chip (Light Emitting Diodes, LED) is mounted on a wafer substrate (Wafer) utilizes steps such as photoresist, exposure, development and oxidation diffusion etching of the semiconductor process to form light-emitting diodes 20 (as shown in FIG. 2 ) with many connections. Each light-emitting diode 20 has a positive surface electrode 21 (P pole electrode) and a negative electrode 22 (N pole electrode), and utilize a cutting step to remove the epitaxial layer connected to the adjacent light emitting diode 20 to form a cutout region 25 ( As shown in FIG. 3 ), and utilize a step of forming an extended protective layer to form a protective layer 30 (as shown in FIG. shown), the protective layer 30 is an insulating material with high light transmittance or high reflectivity and has protective functions such as mo...
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