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Thermoplastic poly(ether-ether-ketone) type polyimide and preparation method thereof

A technology of polyimide and polyetheretherketone, applied in the field of polyimide and its preparation, can solve the problems of limited application field, poor processing performance, etc., and achieve low glass transition temperature, good mechanical properties, high The effect of UV transmission

Inactive Publication Date: 2009-05-06
JILIN UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Thermosetting polyimide is usually insoluble and infusible, and its processing performance is poor. Generally, it is prepared into a preform in the polyamic acid stage and then cured. The application field is greatly limited.

Method used

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  • Thermoplastic poly(ether-ether-ketone) type polyimide and preparation method thereof
  • Thermoplastic poly(ether-ether-ketone) type polyimide and preparation method thereof
  • Thermoplastic poly(ether-ether-ketone) type polyimide and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0054] Add 5.0054g (0.01mol) of diamine 1,3-bis(3-aminophenoxy-4'-benzoyl)benzene (BABB) into a reaction flask with electromagnetic stirring, and then add N, N-dimethylacetamide (DMAc) 19.8ml, after diamine dissolved, slowly add 2.9422g (0.01mol ), to ensure that the powder does not agglomerate during the addition. After reacting at room temperature for 5 hours, polyamic acid solution PAA was obtained;

[0055] Pour the PAA solution on a clean glass plate, scrape the PAA solution evenly with a 30um spatula, put it into an ordinary oven that has been adjusted to remove the solvent, control the temperature and time, respectively 50°C, 2 hours, 80°C, 2 hours, 100°C, 4 hours, 150°C, 2 hours, 180°C, 1 hour; then transfer the glass plate to a vacuum oven for imidization, control the temperature and time as 200°C, 1 hour, 250°C, 1 hour, 300°C, 1 hour, after the temperature of the oven naturally drops to room temperature, take it out, peel off the film, and obtain a yellow polyimide...

Embodiment 2

[0056] Add 5.0054g (0.01mol) of diamine 1,3-bis(3-aminophenoxy-4'-benzoyl)benzene (BABB) into a reaction flask with electromagnetic stirring, and then add N, N-dimethylacetamide (DMAc) 20.5ml, after diamine dissolved, slowly add 3,3',4,4'-benzophenonetetraacid dianhydride (BTDA) 3.2223g (0.01mol) , to ensure that the powder does not agglomerate during the addition process. The subsequent treatment process is the same as that in Example 1, and finally a class A brown polyimide polymer film is obtained. The glass transition temperature is about 210°C and the modulus is 3.1GPa.

Embodiment 3

[0058] Add 5.0054g (0.01mol) of diamine 1,3-bis(3-aminophenoxy-4'-benzoyl)benzene (BABB) into a reaction flask with electromagnetic stirring, and then add N, N-dimethylacetamide (DMAc) 17.9ml, after the diamine is dissolved, slowly add 2.1812g (0.01mol) of pyromellitic dianhydride (PMDA) in an equivalent amount to ensure that the powder does not Caking. Its follow-up process is with embodiment 1. Finally, a class A brown polyimide polymer film was obtained. The glass transition temperature is about 225°C and the modulus is 2.6GPa.

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Abstract

The invention belongs to the field of high polymer material, and in particular relates to a few kinds of polyimide with lower glass transition temperature as well as good mechanical properties, thermal stability and high UV transmittance and a method for preparing the same. The method comprises the steps of adding diamine 1,3-bis (3-amino phenoxy-4'-benzoyl) benzene, dianhydride (s-BPDA, a-BPDA, i-BPDA, BTDA, PMDA, ODPA, BPADA or 6FDA) into an organic solvent (DMF, DMAc or NMP ) to react for 2 to 24 hours in an ice-water bath at room temperature under nitrogen protection, or adding end-capping agent aniline or phthalic anhydride so as to obtain polyamic acid solution; then pouring the polyamic acid solution onto a clean glass sheet to remove the organic solvent in an oven after even scrapping; and then performing imidization on the polyamic acid solution in a vacuum oven to obtain a polyimide polymer film of no-sealed end, aniline sealed end, phthalic anhydride sealed end or dianhydride sealed end.

Description

technical field [0001] The invention belongs to the field of macromolecular materials, and in particular relates to several kinds of polymer materials prepared from diamine monomers and dianhydride monomers, which have a lower glass transition temperature and have good mechanical properties, thermal stability, and high ultraviolet light transmittance. Polyimide and its preparation method. Background technique [0002] Aromatic polyimide has outstanding mechanical properties, excellent thermal stability and chemical stability, and has attracted more and more attention. However, due to the good rigidity of the molecular chains and the strong interaction between the molecular chains, many aromatic polyimides are insoluble and non-melting, and cannot be processed and formed by simple methods, which limits their application range. [0003] Polyimide resins are classified into thermosetting and thermoplastic types. Thermosetting polyimide is usually insoluble and infusible, and ...

Claims

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Application Information

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IPC IPC(8): C08G73/10
Inventor 陈春海于晓慧赵晓刚党国栋
Owner JILIN UNIV
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