Method for increasing grinding wafer flatness
A flatness and wafer technology, which is applied in the direction of grinding devices, grinding machine tools, electrical components, etc., can solve the problems affecting the flatness of the wafer, affecting the flatness of the center position of the wafer, and increasing production costs, so as to improve production efficiency and uniform grinding force , Improve the effect of flatness
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[0013] The invention provides a method for improving the flatness of grinding wafers. The method improves the flatness of wafer grinding by adjusting the range of movement of a grinding head in a grinding machine platform.
[0014] see figure 1 , the bottom surface of the grinding head 1 is composed of an adsorption portion and a fixed ring. The suction part (not labeled) is used to absorb the wafer (not shown) for grinding, and the fixing ring (not labeled) is used to fix the wafer.
[0015] The grinding disc 3 is used in conjunction with the grinding head 1, and the grinding disc 3 is used for grinding the copper on the surface of the wafer. During the movement of the grinding head 1, the wafer fixing ring of the grinding head 1 should be completely in contact with the grinding disc 3, so as to ensure that the wafer is subjected to a uniform grinding force, thereby ensuring the flatness of the wafer surface.
[0016] In a preferred embodiment of the present invention, the ...
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