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Resin composition with high-heat, high-glass transition temperature for printed circuit board, prepreg and coating substance

A technology of resin composition and printed circuit board, which is applied in the direction of printed circuit components, circuit substrate materials, synthetic resin layered products, etc., can solve problems such as thermal conductivity not meeting the requirements, and achieve improved service life and stability, Effects of high glass transition temperature and high thermal conductivity

Inactive Publication Date: 2009-01-14
NANYA PLASTICS CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] However, as the circuit density of integrated circuits is getting higher and higher, the heat generated by electronic components is also increasing, and the thermal conductivity of traditional epoxy resin formulations has gradually failed to meet the requirements.

Method used

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  • Resin composition with high-heat, high-glass transition temperature for printed circuit board, prepreg and coating substance
  • Resin composition with high-heat, high-glass transition temperature for printed circuit board, prepreg and coating substance

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0042] Get the bisphenol A type epoxy resin of 20.2 weight parts (EEW ​​(epoxy equivalent)=186g / eq, Nanya Plastics Company, product name: NPEL-128E), the phenol-benzaldehyde type multifunctional epoxy resin of 49.5 weight parts And the tetrabromobisphenol A (TBBA) of 21.2 weight parts, after these 3 kinds of resins were reacted at 170 ℃ for 120 minutes, be cooled to 130 ℃ and add the tetrabromobisphenol A type epoxy resin (EEW=390g / eq, South Asia Plastics Company, product name: NPEB-400) and 2 weight parts of four-functional epoxy resin (South Asia Plastics Company, product name: NPPN-431), after mixing evenly, make brominated epoxy resin EP- 1.

[0043] Brominated epoxy resin EP-1 is dissolved in 20wt% acetone again, is configured into the solution that contains 80wt% brominated epoxy resin EP-1, and the epoxy resin EP-1 that gets like this has EEW (epoxy equivalent)= 378, weight average molecular weight=3366, bromine content=15.8wt%.

[0044] With 100 parts by weight of b...

Embodiment 2

[0049] The resin solution formula of embodiment 1 is changed into the high thermal conductivity powder of blending 400 weight parts, utilizes the Horsfield model to obtain the closest packing model of high thermal conductivity powder, and its specific proportion is the spherical alumina of 72 weight parts (average particle size Diameter D 50 =5μm), 8 parts by weight of spherical alumina (average particle diameter D 50 =0.5μm) and 320 parts by weight of boron nitride (average particle size D 50 =5.5μm), where the actual packing curve of alumina powder is compared with the theoretical closest packing curve as figure 1 .

[0050] The physical properties of the prepared copper foil substrate were tested, and the results are shown in Table 1.

Embodiment 3

[0052] The formula of the resin solution is the same as that in Example 2, but the solid content of the resin solution is adjusted to 75wt%, and then coated on a 35 μm copper foil to form an adhesive-backed copper foil (RCC) with a coating thickness of 100 μm, and then laminated on the resin surface The 35 μm copper foil was pressed, and the pressing conditions were the same as in Example 1. Finally, the physical properties of the copper foil substrate were tested after the copper foil was etched. The results are shown in Table 1.

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Abstract

The invention relates to resin combination with high thermal conductivity and glass transition temperature used for a printed circuit board. According to the weight percentage, the resin combination comprises brominated epoxy resin occupying 20 percent to 70 percent, hardening agent occupying 1 percent to 10 percent, accelerating agent occupying 0.1 percent to 10 percent, inorganic powder occupying 0 percent to 20 percent, high heat conducting powder occupying 5 percent to 85 percent, and processing auxiliary agent occupying 0 percent to 10 percent. The resin combination has the advantages of high glass transition temperature and heat conducting performance, excellent thermal resistance and flame resistance, which can be applied to the heat conducting insulating layer of the printed circuit board after being made into a high heat conducting preimpregnated body through a containing and soaking way or into a high heat conducting coating through a coating way, thus the printed circuit board has high heat conducting performance, and the heat quantity generated by the operation of the electronic elements on the printed circuit board can be rapidly dissipated to enhance the service life and the stability of the electronic elements.

Description

technical field [0001] The invention relates to a resin composition, especially a resin composition with high glass transition temperature (Tg) and high thermal conductivity, which is applied to a printed circuit board as a heat conduction insulating layer. Background technique [0002] The applicant once disclosed a brominated epoxy resin with a high glass transition temperature for glass fiber laminates, and obtained Chinese patent (publication number CN1358780), Taiwan patent No. 196977 and US patent No. 6,512,075. The disclosed brominated epoxy resin is synthesized by tetrabromopropanediol and at least one resin selected from phenol-benzaldehyde multifunctional epoxy resin, bifunctional epoxy resin and bromine-containing bifunctional epoxy resin. Obtained, and the weight-average molecular weight of brominated epoxy resin (M W ) is 1500-4000, the polydispersity index (Mw / Mn ratio) of molecular weight distribution is 1.5-4.0, the epoxy equivalent weight (EEW) is 300-450g / ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L63/00C08K13/02C08K13/04C08K3/28C08K3/22C08K3/34C08K3/38C08K3/04C08J5/24B32B27/00B32B15/092H05K1/03
Inventor 谢嵩岳冯殿润廖德超陈豪升
Owner NANYA PLASTICS CORP
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