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Epoxy resin micro-capsule and its preparation method

An epoxy resin and microcapsule technology, which is applied in the direction of microcapsule preparation and microsphere preparation, can solve the problems of unsuitable scale production, complicated polymerization process, and long polymerization time, and achieve easy large-scale preparation, simple process, and granular The effect of narrow diameter distribution

Inactive Publication Date: 2008-12-10
SUN YAT SEN UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

This method takes a long time to polymerize, and the polymerization process is complicated, so it is not suitable for large-scale production

Method used

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  • Epoxy resin micro-capsule and its preparation method
  • Epoxy resin micro-capsule and its preparation method

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0029] (1) Dissolve 15g of gum arabic in 500g of deionized water, and add 20g of epoxy resin E-51 for the core material, 5g of epoxy acrylate for wall material E-51, 15g of SVS, and 0.5g of PETA in sequence under stirring in a homogenizer And UV-907 0.2g of the mixture, emulsified for 10min, to obtain an oil-in-water emulsion.

[0030] (2) Immediately irradiate the oil-in-water emulsion obtained in step (1) with ultraviolet light (power 1500w, lamp distance 10cm) for 10 minutes to make the surface of the oil-in-water solidify into a film, add a large amount of water to repeatedly settle and wash, and the microcapsule precipitate Vacuum freeze-drying to obtain a microcapsule product, the average diameter of the microcapsule is 25 μm, the wall thickness is 200 nm, and the weight ratio of capsule core / capsule wall is 2.0. The scanning electron microscope image of the microcapsules is shown in figure 1 , the scanning electron microscope image of the ruptured microcapsules is show...

Embodiment 2

[0032] (1) Dissolve 15g of gelatin in 500g of deionized water, add core material epoxy resin J-8020g and wall material J-80 epoxy acrylate 5g, HPMAS 15g, TMPTMA 0.5g and UV - 11730.2g of the mixture, emulsified for 10min to obtain an oil-in-water emulsion.

[0033] (2) Immediately irradiate the oil-in-water emulsion obtained in step (1) with ultraviolet light (power 1500w, lamp distance 10cm) for 10 minutes to make the surface of the oil-in-water solidify into a film, add a large amount of water to repeatedly settle and wash, and the microcapsule precipitate Vacuum freeze-drying to obtain a microcapsule product, the average diameter of the microcapsule is 20 μm, the wall thickness is 250 nm, and the weight ratio of capsule core / capsule wall is 1.8.

Embodiment 3

[0035] (1) Dissolve 15g of ethylene-maleic anhydride copolymer sodium salt in 500g of deionized water, and add 20g of core material epoxy resin 711 and 5g of wall material E-711 epoxy acrylate, HAPS in sequence under stirring in a homogenizer The mixture of 15g, TRGTMA 0.5g and UV-1840.2g was emulsified for 10min to obtain an oil-in-water emulsion.

[0036] (2) Immediately irradiate the oil-in-water emulsion obtained in step (1) with ultraviolet light (power 1500w, lamp distance 10cm) for 10 minutes to make the surface of the oil-in-water solidify into a film, add a large amount of water to repeatedly settle and wash, and the microcapsule precipitate Vacuum freeze-drying to obtain a microcapsule product, the average diameter of the microcapsule is 15 μm, the wall thickness is 300 nm, and the weight ratio of capsule core / capsule wall is 1.6.

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Abstract

The invention discloses an epoxy resin microcapsule and a preparation method thereof. The epoxy resin microcapsule comprises a capsule core and a capsule wall, wherein, the capsule core is an epoxy resin, and the capsule wall is a composition of an aepoxy acrylate resin, a polymerizable emulsifying agent, a crosslinking agent and an optical initiator; and the polymerization method of the capsule wall is ultraviolet irradiation and film forming through curing. The preparation method for the microcapsule comprises the following steps that: core materials, wall materials and an ultraviolet initiator are added into a water solution which is dissolved with a surfactant in turn under the condition of high-speed stirring; after an oil-in-water emulsion system is prepared by emulsification, ultraviolet light is immediately used for irradiating the emulsion, and the surface compositions of oil-in-water liquid droplets undergo in-situ polymerization and film forming through curing; a great dealof water is added for repeated sedimentation and water scrubbing; and microcapsule products are prepared through vacuum freeze drying of microcapsule deposits. The method has a simple technique, low energy consumption, quick speed and friendly environment. The capsule prepared takes the shape of a regular sphere, has good leak tightness and heat resistance, and can be widely applied to self-repairing of self-setting thread fasteners and thermosetting resin substrate composite materials.

Description

technical field [0001] The invention relates to a microcapsule and its preparation technology. Background technique [0002] Microcapsules are substances coated in tiny containers with a diameter of 1-1000 μm, so as to protect, control release, improve stability and shield toxicity, so they are widely used in the isolation, protection and printing of active components in the food industry. Pressure-sensitive color-changing copy paper in the industry, targeted drugs in the pharmaceutical industry, and spice adhesives in the daily chemical industry. In recent years, the self-healing technology of polymer materials based on microcapsules has become a new focus in the application of microcapsules. [0003] White et al. wrapped cyclopentadiene dimer (DCPD) in microcapsules made of urea-formaldehyde resin and dispersed them in epoxy resin-based composites with Grubbs catalyst powder. When the material cracked, the microcapsules ruptured and the ring The pentadiene dimer quickly ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08K5/15C08K9/10B01J13/14B29C73/22
Inventor 容敏智肖定书章明秋
Owner SUN YAT SEN UNIV
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