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Method for preparing high-compact blocky tungsten nickel alloy

A tungsten-nickel alloy and dense technology, which is applied in the field of nano-microcrystalline bulk material preparation, can solve the problems of complex process, difficulty in ensuring the uniform density of material micro-regions, and affecting the performance of tungsten-nickel alloy body, and achieve the effect of simple process

Inactive Publication Date: 2008-11-19
BEIJING UNIV OF TECH
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  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

But the problem is that tungsten materials are not mutually soluble with nickel, whether in liquid or solid state. Using traditional casting, forging and powder metallurgy technologies, not only the process is complicated, but also precision powder making process is required to obtain uniform, small and high-purity W- Ni powder, because the grain or particle boundary impurity segregation (such as H, O, P, etc.) has an adverse effect on the subsequent sintering process, and due to the existence of powder agglomeration during the sintering process, it is difficult to ensure that the material micro-area density is uniform and free of defects , thus affecting the actual performance of the tungsten-nickel alloy body

Method used

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  • Method for preparing high-compact blocky tungsten nickel alloy
  • Method for preparing high-compact blocky tungsten nickel alloy

Examples

Experimental program
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example 1

[0015] Example 1: The specific implementation conditions are shown in Table 3.

[0016] Table 3 Specific implementation conditions and results

[0017] Item

example 2

[0018] Example 2: The specific implementation conditions are shown in Table 4.

[0019] Table 4 Specific implementation conditions and results

[0020] Item

example 3

[0021] Example 3: The specific implementation conditions are shown in Table 5.

[0022] Table 5 Specific implementation conditions and results

[0023] Item

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PUM

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Abstract

The invention provides a method for preparing highly compact block tungsten-nickel alloy, belonging to alloy field. The method is characterized in that in electroforming process, a DC power supply is used, the voltage is 3 to 5V, and the current density is 1 to 12A / dm2; an anode and a cathode are inserted in electroforming liquid; the anode is pure nickel and the cathode is stainless steel or Ti; the electroforming liquid includes the following components: 120 to 350g / L of nickel sulphamate, 20 to 45g / L of nickel chloride, 480 to 1400g / L of sodium tungstate and 10 to 50g / L of boric acid; the electroforming liquid are stirred in the electroforming process, and the stirring speed is 60 to 130rev. / min; the electroforming process is carried out under the constant temperature of 550 DEG C, and residues are filtered; the electroforming time is controlled within 1 to 12 hours. The method of the invention has the advantages that the highly compact block tungsten-nickel alloy is successfully prepared by arranging Ni atoms and W atoms inside the electro-crystallization grains in the mode of mutual clearance occupation.

Description

Technical field [0001] The invention belongs to the technical field of preparation of nano-micron crystal bulk materials, and in particular provides a method for preparing high-density bulk tungsten-nickel alloys, which solves the problem of difficult preparation of high-density bulk tungsten-nickel alloys, especially nano-micron crystal bulk materials. Background technique [0002] Tungsten-nickel alloy as a high specific gravity alloy can not only be used in the military field, such as for the manufacture of armor-piercing bombs, but also as high-temperature structural materials and electrical materials. It can also be widely used in electrical, aerospace and other fields. For example, it can be used to manufacture engine jets. Tubes, electrical contacts, electro-optical materials, etc. But the problem is that tungsten materials do not dissolve with nickel in liquid or solid state. The traditional casting, forging and powder metallurgy technologies are used, not only the proces...

Claims

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Application Information

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IPC IPC(8): C25D1/00
Inventor 范爱玲马捷王维魏建忠王从曾
Owner BEIJING UNIV OF TECH
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