Piezoelectric element, manufacturing method thereof and liquid discharge apparatus
A piezoelectric element and a manufacturing method technology, which are applied in the manufacture/assembly of piezoelectric/electrostrictive devices, electrical components, piezoelectric devices/electrostrictive devices, etc., and can solve problems such as low usefulness
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[0171] As a substrate, a Si single crystal substrate having a 300 nm-thick thermal oxide film formed on the surface was prepared. On the surface of the substrate, a 20 nm-thick Ti adhesion layer and a 200 nm-thick Pt lower electrode were sequentially formed by sputtering at a substrate temperature of 300°C.
[0172] Next, a 4 μ thick Nb-doped PZT piezoelectric film was formed on the lower electrode by sputtering at a substrate temperature of 550°C. Next, a Pt upper electrode with a thickness of 200 nm was grown at room temperature by sputtering to obtain the piezoelectric element of the present invention.
[0173] Finally, on the back side of the Si substrate, use Al as a mask to form a pattern using ICP-RIE (inductivelycoupled plasma-reactive ion etching) to form a 300μm×300μm ink chamber, and form a vibration plate and an ink chamber through the processing of the substrate itself. chamber and the ink nozzle of the ink discharge port to obtain the ink jet recording head of t...
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