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Process for producing silver-plated copper powder for low-temperature slurry

A technology of silver-plated copper powder and slurry, which is applied in liquid chemical plating, metal material coating process, coating, etc., can solve the problems of low cumulative formation constant and unsuitable comprehensive performance of silver-plated copper powder, etc., and achieve replacement Effects of Reaction Rate Reduction, Excellent Electrical Conductivity, and Antioxidant Performance

Active Publication Date: 2008-10-29
云南铜业科技发展股份有限公司 +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] In summary, in domestic and foreign patent announcements and literature reports, the preparation technology of silver-plated copper powder is an alkaline plating solution system, and the alkaline complexing agent used in it is except for cyanide, and the remaining complexing agents form silver ions. The cumulative formation constants of the complexes are all low, so the overall performance of the silver-plated copper powder prepared by the above method is not suitable for replacing the bright silver powder for low-temperature paste

Method used

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  • Process for producing silver-plated copper powder for low-temperature slurry

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0018] Embodiment 1: the preparation of 20% silver-plated copper powder of silver content

[0019] Add 60kg, 120kg, and 20kg of Φ3, Φ5, and Φ10 stainless steel balls into the stirring ball mill respectively. Take 10kg of electrolytic copper powder with a particle size of -325 mesh, 20g of PVP, 30g of stearic acid, and 20kg of absolute ethanol, and put them into a stirring ball mill to grind the copper powder to D 50 After the thickness is 10-20 μm, the material is discharged for use.

[0020] Take 86g of the above-mentioned copper powder, add 0.9L of water, 2g of OP dispersant, and 10ml of 98% sulfuric acid into a beaker, keep stirring and washing for 20min, and then wash with deionized water until neutral. Add 0.9L of water and 0.5g of OP dispersant to the cleaned copper powder, stir evenly with a stirrer and set aside.

[0021] Get silver nitrate 31.7g, dissolve with 200ml deionized water; Get main complexing agent tartaric acid 44.5g, auxiliary complexing agent mercaptosu...

Embodiment 2

[0022] Embodiment 2: the preparation of 30% silver-plated copper powder of silver content

[0023] The preparation method of flake copper powder is basically the same as that of Example 1. The difference is that the copper powder is atomized copper powder with an average particle size of 8 μm, and the antioxidants are polyether and dodecanoic acid, both of which are used in an amount of 25 g.

[0024] Take 0.81kg of the above-mentioned copper powder, add 8L of water, 20g of OP dispersant, and 80ml of 98% sulfuric acid into a beaker, keep stirring and washing for 20min, and then wash with deionized water until neutral. Add 8L of water and 5g of OP dispersant to the cleaned copper powder, stir evenly with a stirrer and set aside.

[0025] Get silver nitrate 476g, dissolve with 3L deionized water; Get main complexing agent tartaric acid 645g, auxiliary complexing agent nitrosonaphthol, each 2.5g of diethylaminodithioformic acid, after dissolving with 2.50L deionized water and T...

Embodiment 3

[0026] Embodiment 3: the preparation of 45% silver-plated copper powder of silver content

[0027] The preparation steps of the flake copper powder are basically the same as in Example 1. The difference is that the antioxidants are zinc stearate and polyethylene glycol, and the dosages are 30g and 20g respectively.

[0028] Take 0.683kg of the above-mentioned copper powder, add 7L of water, 17g of OP dispersant, and 70ml of 98% sulfuric acid into a beaker, keep stirring and washing for 20min, and then wash with deionized water until neutral. Add 7L of water and 4.5g of OP dispersant to the cleaned copper powder, stir evenly with a stirrer and set aside.

[0029] Get silver nitrate 714g, dissolve with 3.5L deionized water; Get main complexing agent tartaric acid 745g, auxiliary complexing agent phenanthroline, 8-hydroxyquinoline each 4.5g, after dissolving with 8L deionized water, mix with above-mentioned silver nitrate solution Mix evenly, add the silver-containing solution ...

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Abstract

The invention relates to a method for preparing silver-coated copper powder used for low-temperature paste, which belongs to the technology field of surface treatment. The method comprises the following steps: copper powder balls are ground to D50, namely 10 to 20 micron, oxidizing layers are removed through acid washing, then deionized water is used to ensure the copper powder to be washed to be neutral, water and dispersant are added for even stirring, acidic silver-contained solution is added in the copper powder paste so that cyanide-free chemical silvering reaction is performed, and after the reaction is completed, the silver-coated copper powder product provided with 20 to 45 percent of silver content and used for low-temperature paste can be obtained through cleaning, surface modification, drying and sieving treatment. The method has the advantages of high silvering efficiency, even coating, simple process and low production cost. The electric volume resistivity of the silver-coated copper powder prepared by the method is 2 to 3*10-4 omega cm, and the silver-coated copper powder can be partly or fully replace the pure silver powder in the low-temperature electronic paste field.

Description

Technical field: [0001] The invention relates to a preparation method of silver-plated copper powder for low-temperature slurry, which belongs to the technical field of surface treatment. Background technique: [0002] With the rapid development of the electronics industry and the continuous rise of silver prices, the electronics industry urgently needs a new type of conductive filler that can completely or partially replace silver powder to reduce costs. Silver-plated copper powder, silver-plated nickel powder, silver-plated graphite powder and silver-plated glass microspheres are produced under such a background. Since the price of copper is less than 1 / 50 of the price of silver, and its electrical conductivity is equivalent to that of silver, it is better than nickel, graphite and glass. Therefore, the silver-plated copper powder made of copper as the base material has a very high cost performance; at the same time , evenly plating a layer of silver on the surface of cop...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C23C18/42B22F1/02
Inventor 施安徐茂黄娜吴于川王勤崔宁纪云腾杨历国
Owner 云南铜业科技发展股份有限公司
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