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Preparation method of high-strength superfine ultra-fine grain copper strip

A technology of ultra-fine grain and copper strip, applied in metal rolling, manufacturing tools, metal rolling, etc., can solve the problem of inability to realize continuous production of high-performance ultra-fine grain materials, high technical requirements for operators, complex production process, etc. problem, to achieve the effect of overcoming the problem of interface pollution, good application prospects, and overcoming the growth of clusters

Inactive Publication Date: 2008-10-22
KUNMING UNIV OF SCI & TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

However, these methods cannot realize the continuous production of high-performance ultra-fine-grained materials due to the limitation of the mold, or due to the complicated process and production process, the production cost is high, and the preparation process has high technical requirements for the operator.

Method used

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  • Preparation method of high-strength superfine ultra-fine grain copper strip

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Experimental program
Comparison scheme
Effect test

Embodiment 1

[0021] Use a copper plate with a thickness of 2 mm for homogenization annealing at a temperature of 600 ° C for 60 minutes to obtain a copper material with a uniform structure and a grain size of 350 μm, and then cool with the furnace; the surface of the homogenized annealed copper plate Grinding to remove impurities on the surface, roughening the interface during the asynchronous rolling process, and making it easy to combine; The secondary reduction rate is 50%, and the equivalent effect becomes 4.0 to realize the combination of two separated copper strips. The superimposed interface must be polished and textured during each pass of asynchronous superimposed rolling; finally, annealing is carried out, and in a vacuum state, Annealing time: 30min, annealing temperature: 250℃; the thickness of the obtained copper material is 2mm, the average grain size is 0.3μm, the yield strength is 373.3Mpa, the tensile strength is 419.7Mpa, the ductility is good, and the electrical conductiv...

Embodiment 2

[0023] Use a copper plate whose thickness is required to be 1.5mm, and perform homogenization annealing at a temperature of 650°C for 90 minutes to obtain a copper material with a uniform structure and a grain size of 500 μm, and then cool with the furnace; the homogenized annealed copper plate The surface is polished to remove impurities on the surface, so that the interface of the asynchronous stack rolling process is roughened and easy to combine; The pass reduction rate is 50%, and the equivalent effect becomes 4.8 to realize the combination of two separated copper strips. The superimposed interface must be polished and textured during each pass of asynchronous superimposed rolling; , annealing time: 40min, annealing temperature: 220°C; the thickness of the obtained copper material is 1.5mm, the average grain size is 0.6μm, the yield strength is 380MPa, the tensile strength is 424.5Mpa, the ductility is good, and the electrical conductivity has not decreased.

Embodiment 3

[0025] Use a copper plate whose thickness is required to be 0.5 mm, and perform homogenization annealing at a temperature of 550°C for 60 minutes to obtain a copper material with a uniform structure and a grain size of 180 μm, and then cool with the furnace; the homogenized annealed copper plate The surface is polished to remove impurities on the surface, so that the interface of the asynchronous stack rolling process is roughened and easy to combine; The pass reduction rate is 50%, and the equivalent effect becomes 8.0 to realize the combination of two separated copper strips. The superimposed interface must be polished and textured during each pass of asynchronous superimposed rolling; , annealing time: 30min, annealing temperature: 400°C; the thickness of the obtained copper material is 1.0mm, the average grain size is 1.2μm, the yield strength is 366.4MPa, the tensile strength is 396.5Mpa, the ductility is good, and the electrical conductivity does not decrease.

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Abstract

The invention provides a preparation method of a high-strength ultra-fine crystal copper strip material, belonging to the field of mechanism and metallurgy combination processing of nonferrous ultra-fine crystal material. The method of the invention adopts a multi-time asynchronous lamination rolling process method to lead the grains of large-grain copper plate to be fined; the strength of the gained ultra-fine crystal copper material is improved by twice, the electrical conductivity is not reduced and the gained material has good extensibility. The method of the invention solves the composition of interface in the deformation of the material, reduces the rolling pressure and energy consumption, improves the precision of the product and realizes the continuous preparation and production of the high-strength ultra-fine crystal material.

Description

technical field [0001] The invention relates to a preparation method of a high-strength ultra-fine-grained copper strip, which belongs to the field of mechanical and metallurgical combined processing of non-ferrous metal ultra-fine-grained materials. Background technique [0002] Precision high-performance copper strip is a kind of structural or functional material with excellent comprehensive physical and mechanical properties, and has been widely used in electronics, instrumentation, communications, automobiles, micro-mechanics and information network engineering. In particular, the application of lead frame copper strips, high-strength and high-conductivity copper strips, precision composite strips, strips for plastic micro-molding, and biomedical materials has developed rapidly. The grain size of the copper material is reduced to the ultrafine grain level, and at room temperature, a series of huge and beneficial changes occur in the performance, especially at room temper...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B21B1/22B21B37/00C21D9/46C21D9/52C21D11/00
Inventor 史庆南王军丽王效琪
Owner KUNMING UNIV OF SCI & TECH
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